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"TREZZA, JOHN"
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"TREZZA, JOHN"
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ULTRA-THIN STACKED CHIPS PACKAGING
by
TREZZA JOHN
Year of Publication
31.05.2012
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PLATED PILLAR PACKAGE FORMATION
by
TREZZA JOHN
Year of Publication
08.05.2012
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SIDE STACKING APPARATUS AND METHOD
by
TREZZA JOHN
Year of Publication
30.12.2010
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CONDUCTIVE VIA FORMATION
by
TREZZA JOHN
Year of Publication
04.03.2010
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FRONT-END PROCESSED WAFER HAVING THROUGH-CHIP CONNECTIONS
by
TREZZA JOHN
Year of Publication
04.09.2009
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Patent
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WAFER VIA FORMATION
by
TREZZA JOHN
Year of Publication
13.07.2009
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POST-SEED DEPOSITION PROCESS
by
CALLAHAN JOHN
,
TREZZA JOHN
Year of Publication
04.11.2009
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OPTO-ELECTRONIC DEVICE INTEGRATION
by
DUDOFF GREG
,
TREZZA JOHN
Year of Publication
29.07.2009
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CHIP CONNECTOR
by
CALLAHAN JOHN
,
TREZZA JOHN
,
DUDOFF GREGORY
Year of Publication
10.05.2012
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CHIP CONNECTOR
by
CALLAHAN JOHN
,
TREZZA JOHN
,
DUDOFF GREGORY
Year of Publication
07.12.2011
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Hybrid integrated circuits and single chip parallel optical transceivers
by
Trezza, J.A.
Published in
The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004
(2004)
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Conference Proceeding
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TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
by
Dugas, Roger
,
Trezza
,
John
Year of Publication
22.08.2019
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Tooling for coupling multiple electronic chips
by
Dugas, Roger
,
Trezza
,
John
Year of Publication
02.07.2019
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Inverse chip connector
by
TREZZA JOHN
Year of Publication
30.09.2014
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TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
by
Trezza John
,
Dugas Roger
Year of Publication
01.02.2018
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Tooling for coupling multiple electronic chips
by
Trezza John
,
Dugas Roger
Year of Publication
05.09.2017
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Processed wafer via
by
TREZZA JOHN
Year of Publication
04.02.2014
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FRONT-END PROCESSED WAFER HAVING THROUGH-CHIP CONNECTION
by
JOHN TREZZA
Year of Publication
05.09.2013
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Triaxial through-chip connection
by
TREZZA JOHN
Year of Publication
04.06.2013
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TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
by
Trezza John
,
Dugas Roger
Year of Publication
03.11.2016
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