THERMAL INTERFACE ADHESIVE AND REPROCESSING
DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 24.11.2005
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Year of Publication 24.11.2005
Patent
THERMAL INTERFACE ADHESIVE AND REWORK
DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 17.11.2005
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Year of Publication 17.11.2005
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Interface adhesive compsn. and rework prepn
SACHDEV KRISHNA G.,BERGER DANIEL G.,CHIOUJONES KELLY M.,DAVES GLENN G.,TOY HILTON T
Year of Publication 16.11.2005
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Year of Publication 16.11.2005
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Apparatus and methods for cooling semiconductor integrated circuit package structures
SIKKA KAMAL K, TOY HILTON T, GELORME JEFFREY D, COLGAN EVAN G, ZITZ JEFFREY A
Year of Publication 01.09.2005
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Year of Publication 01.09.2005
Patent
Thermal interface adhesive and rework
BERGER, DANIEL G, DAVES, GLENN G, TOY, HILTON T, SACHDEV, KRISHNA G, CHIOUJONES, KELLY M
Year of Publication 01.01.2012
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Year of Publication 01.01.2012
Patent
Package cooling designs for a dual-chip electronic package with one high power chip
Arvelo, A., Toy, H., Sikka, K., Tai, A., Longworth, H., Wei Zou, Coffin, J.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
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Conference Proceeding
Package with low stress hermetic seal
Goldmann, Lewis Sigmund, Perfecto, Eric Daniel, Sherif, Raed A, Shutler, William Frederick, Toy, Hilton T
Year of Publication 01.10.2002
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Year of Publication 01.10.2002
Patent
Package with low stress hermetic seal
GOLDMANN LEWIS SIGMUND, TOY HILTON T, SHERIF RAED A, PERFECTO ERIC DANIEL, SHUTLER WILLIAM FREDERICK
Year of Publication 01.10.2002
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Year of Publication 01.10.2002
Patent
Land grid array (LGA) module assembly that maximizes substrate area for electronic devices
ELLSWORTH MICHAEL JOSEPH, TOY HILTON T, TOROK JOHN G, ZITZ JEFFREY ALLEN, EDWARDS DAVID LINN
Year of Publication 26.09.2002
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Year of Publication 26.09.2002
Patent
Package with low stress hermetic seal
GOLDMANN LEWIS SIGMUND, TOY HILTON T, SHERIF RAED A, PERFECTO ERIC DANIEL, SHUTLER WILLIAM FREDERICK
Year of Publication 11.07.2002
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Year of Publication 11.07.2002
Patent
Low stress hermetic seal
Goldmann, Lewis Sigmund, Perfecto, Eric Daniel, Sherif, Raed A, Shutler, William Frederick, Toy, Hilton T
Year of Publication 29.01.2002
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Year of Publication 29.01.2002
Patent
Low stress hermetic seal
GOLDMANN LEWIS SIGMUND, TOY HILTON T, SHERIF RAED A, PERFECTO ERIC DANIEL, SHUTLER WILLIAM FREDERICK
Year of Publication 29.01.2002
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Year of Publication 29.01.2002
Patent
Method for controlling thermal interface gap distance
EMMETT MICHAEL J, IRUVANTI SUSHUMNA, TOY HILTON T, SHERIF RAED A, EDWARDS DAVID L, SIKKA KAMAL
Year of Publication 25.09.2001
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Year of Publication 25.09.2001
Patent