3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators
Mandalapu, Chandra Sekhar, Buch, Chintan, Shah, Priyal, Topacio, Roden, Cheng, Patrick, Wang, Liwei, Swaminathan, Raja, Smith, Alan, Wuu, John, Mysore, Kaushik, Alam, Arsalan
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding