Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
Too, Elena H, Gerst, Paul R, Paneccasio, Jr., Vincent, Hurtubise, Richard W
Year of Publication 17.08.2004
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Year of Publication 17.08.2004
Patent
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
PANECCASIO, JR. VINCENT, HURTUBISE RICHARD W, GERST PAUL R, TOO ELENA H
Year of Publication 17.08.2004
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Year of Publication 17.08.2004
Patent
ELECTROPLATING CHEMISTRY FOR THE CU FILLING OF SUBMICRON FEATURES OF VLSI/ULSI INTERCONNECT
HURTUBISE, RICHARD, W, GERST, PAUL, R, TOO, ELENA, H, PANECCASIO, VINCENT, JR
Year of Publication 13.03.2003
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Year of Publication 13.03.2003
Patent
ELECTROPLATING CHEMISTRY FOR THE CU FILLING OF SUBMICRON FEATURES OF VLSI/ULSI INTERCONNECT
HURTUBISE, RICHARD, W, GERST, PAUL, R, TOO, ELENA, H, PANECCASIO, VINCENT, JR
Year of Publication 27.12.2002
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Year of Publication 27.12.2002
Patent