Effect of copper over-pad metallization on reliability of aluminum wire bonds
Kawashiro, Fumiyoshi, Takao, Kentaro, Kobayashi, Tatsuya, Yoshikawa, Masaaki, Miyake, Eitaro, Endo, Yoshiki, Tonedachi, Tatsuo, Nishikawa, Hiroshi
Published in Microelectronics and reliability (01.08.2019)
Published in Microelectronics and reliability (01.08.2019)
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Journal Article
Effect of Aluminum Clad Cu Wire Bonds on Power Cycle Lifetime for High Current Density Power Module Packages
KAWASHIRO, Fumiyoshi, YOSHIKAWA, Masaaki, MIYAKE, Eitaro, ENDO, Yoshiki, TONEDACHI, Tatsuo, NISHIKAWA, Hiroshi
Published in Journal of Smart Processing (10.03.2022)
Published in Journal of Smart Processing (10.03.2022)
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Journal Article
LED MODULE DEVICE AND METHOD FOR MANUFACTURING SAME
TAKEUCHI, TERUO, TONEDACHI, TATSUO, TOYOSHIMA, TSUTOMU, NARASAKI, KAZUKI, TAKEHARA, YASUYUKI, ISHIHARA, MASAMICHI
Year of Publication 14.07.2011
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Year of Publication 14.07.2011
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