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Year of Publication 10.11.2015
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NOVEL UNDERFILL MATERIAL HAVING ENHANCED ADHESION
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Year of Publication 02.05.2012
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Year of Publication 02.05.2012
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UNDERFILL COMPOSITION AND PACKAGE SOLID STATE DEVICE
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Year of Publication 30.04.2012
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Year of Publication 30.04.2012
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Wafer level interconnection and method
ERLBAUM, JEFFREY SCOTT, NAGARKAR, KAUSTUBH RAVINDRA, BURDICK, JR. WILLIAM EDWARD, TONAPI, SANDEEP SHRIKANT
Year of Publication 22.01.2014
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Year of Publication 22.01.2014
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Curable composition, cured film and related electronic device
CAMPBELL, JOHN ROBERT, RUBINSZTAJN, SLAWOMIR, TONAPI, SANDEEP SHRIKANT, MILLS, RYAN CHRISTOPHER, PRABHAKUMAR, ANANTH
Year of Publication 03.07.2013
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Year of Publication 03.07.2013
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THERMALLY CONDUCTIVE COMPOSITION AND METHOD FOR PREPARING THE SAME
DAVID, JENNIFER, MENEGHETTI, PAULO, MANICCIA, LAURENCE, TONAPI, SANDEEP, SHRIKANT, HANS, PAUL, JOSEPH, GOWDA, ARUN, VIRUPAKSHA, PAISNER, SARA, NAOMI, STROSAKER, GREGORY, A, ESLER, DAVID, RICHARD, SHAFFER, GREGORY W, ZHONG, HONG, FORTUNA, ROBERT, VICTOR, HOLLISTER
Year of Publication 07.10.2015
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Year of Publication 07.10.2015
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Cure catalyst, composition, electronic device and associated method
CAMPBELL JOHN ROBERT, MILLS RYAN CHRISTOPHER, PRABHAKUMAR ANANTH, RUBINSZTAJN SLAWOMIR, TONAPI SANDEEP SHRIKANT
Year of Publication 01.11.2011
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Year of Publication 01.11.2011
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Cure catalyst, composition, electronic device and associated method
Rubinsztajn, Slawomir, Campbell, John Robert, Mills, Ryan Christopher, Tonapi, Sandeep Shrikant, Prabhakumar, Ananth
Year of Publication 01.11.2011
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Year of Publication 01.11.2011
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Curable composition, cured film and related electronic device
CAMPBELL, JOHN ROBERT, RUBINSZTAJN, SLAWOMIR, TONAPI, SANDEEP SHRIKANT, MILLS, RYAN CHRISTOPHER, PRABHAKUMAR, ANANTH
Year of Publication 16.02.2011
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Year of Publication 16.02.2011
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Thermal management system and associated method
Zhang, Jian, Tonapi, Sandeep Shrikant, Mills, Ryan Christopher, Gowda, Arun Virupaksha
Year of Publication 21.09.2010
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Year of Publication 21.09.2010
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Thermal management system and associated method
GOWDA ARUN VIRUPAKSHA, ZHANG JIAN, MILLS RYAN CHRISTOPHER, TONAPI SANDEEP SHRIKANT
Year of Publication 21.09.2010
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Year of Publication 21.09.2010
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Novel underfill material having enhanced adhesion
RUBINSZTAJN SLAWOMIR,CAMPBELL JOHN,PRABHAKUMAR ANANTH,TONAPI SANDEEP SHRIKANT
Year of Publication 21.02.2007
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Year of Publication 21.02.2007
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NOVEL UNDERFILL MATERIAL HAVING ENHANCED ADHESION
CAMPBELL JOHN, PRABHAKUMAR ANANTH, RUBINSZTAJN SLAWOMIR, TONAPI SANDEEP SHRIKANT
Year of Publication 01.12.2006
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Year of Publication 01.12.2006
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Wafer level interconnection and method
SANDEEP SHRIKANT TONAPI, WILLIAM EDWARD BURDICK JR, KAUSTUBH NAGARKAR, JEFFREY SCOTT ERLBAUM
Year of Publication 29.10.2009
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Year of Publication 29.10.2009
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WAFER LEVEL INTERCONNECTION AND METHOD
NAGARKAR KAUSTUBH RAVINDRA, BURDICK, JR. WILLIAM EDWARD, ERLBAUM JEFFREY SCOTT, TONAPI SANDEEP SHRIKANT
Year of Publication 15.10.2009
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Year of Publication 15.10.2009
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Wafer level interconnection and method
BURDICK, WILLIAM EDWARD, JR, ERLBAUM, JEFFREY SCOTT, NAGARKAR, KAUSTUBH RAVINDRA, TONAPI, SANDEEP SHRIKANT
Year of Publication 14.10.2009
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Year of Publication 14.10.2009
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NOVEL UNDERFILL MATERIAL HAVING ENHANCED ADHESION
TONAPI, SANDEEP, SHRIKANT, RUBINSZTAJN, SLAWOMIR, CAMPBELL, JOHN, PRABHAKUMAR, ANANTH
Year of Publication 06.09.2006
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Year of Publication 06.09.2006
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COMBINATIONS OF RESIN COMPOSITIONS AND METHODS OF USE THEROF
RUBINSZTAJN, SLAWOMIR, TONAPI, SANDEEP SHRIKANT, CAMPBELL, JOHN, PRABHAKUMAR, ANANTH, MILLS, RYAN
Year of Publication 28.08.2009
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Year of Publication 28.08.2009
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Thermal conductive material utilizing electrically conductive nanoparticles
Tonapi, Sandeep Shrikant, Zhong, Hong, Simone, Davide Louis, Fillion, Raymond Albert
Year of Publication 23.06.2009
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Year of Publication 23.06.2009
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Thermal conductive material utilizing electrically conductive nanoparticles
SIMONE DAVIDE LOUIS, ZHONG HONG, FILLION RAYMOND ALBERT, TONAPI SANDEEP SHRIKANT
Year of Publication 23.06.2009
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Year of Publication 23.06.2009
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