Ultra-Thin 50 um Fan-Out Wafer Level Package: Development of an Innovative Assembly and De-bonding Concept
Woehrmann, Markus, Braun, Tanja, Toepper, Michael, Land, Klaus-Dieter
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, Asha, Rieth, Loren, Tathireddy, Prashant, Harrison, Reid, Oppermann, Hermann, Klein, Matthias, Töpper, Michael, Jung, Erik, Normann, Richard, Clark, Gregory, Solzbacher, Florian
Published in Journal of neural engineering (01.08.2011)
Published in Journal of neural engineering (01.08.2011)
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Journal Article
Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, Der-Song, Khuri-Yakub, Pierre, Bonitz, Barry, Davies, Todd, Thomas, Glen, Otto, Bernd, Töpper, Michael, Fritzsch, Thomas, Ehrmann, Oswin, Wodnicki, Robert, Zhuang, Xuefeng, Woychik, Charles, Thomenius, Kai E., Fisher, Rayette A., Mills, David M., Byun, Albert J., Burdick, William
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.07.2013)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.07.2013)
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Journal Article
Low temperature glass-thin-films for use in power applications
Leib, J., Gyenge, O., Hansen, U., Maus, S., Hauck, K., Ndip, I., Toepper, M.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Marquardt, Krystan, Hahn, Robert, Blechert, Martin, Lehmann, Marco, Töpper, Michael, Wilke, Martin, Semionyk, Peter, von Suchodoletz, Maria, Reichl, Herbert
Published in Microsystem technologies (01.07.2010)
Published in Microsystem technologies (01.07.2010)
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Journal Article
Conference Proceeding
Evaluation of WLP Dielectrics for High Voltage Applications
Paeck, Marcus, Woehrmann, Markus, Toepper, Michael, Lang, Klaus-Dieter
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Aqueous-Base-Developable Benzocyclobutene-Based Dielectric Material - An Emerging Dielectric Material for Microelectronics
So, Ying-Hung, Stark, Edmund, Kisting, Scott, Scheck, Dan, Baranek, Kayla, Toepper, Michael, Baumgartner, Tobias
Published in ECS transactions (27.04.2007)
Published in ECS transactions (27.04.2007)
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Journal Article
Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I, Löbbicke, Kai, Tschoban, C, Töpper, Michael, Guttowski, S, Reichl, H, Lang, K
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding
An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging
Gernhardt, Robert, Wohrmann, Markus, Muller, Friedrich, Hauck, Karin, Topper, Michael, Lang, Klaus-Dieter, Hichri, Habib, Arendt, Markus
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
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Conference Proceeding
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, Michael, Ndip, Ivan, Erxleben, Robert, Brusberg, Lars, Nissen, Nils, Schröder, Henning, Yamamoto, Hidefumi, Todt, Guido, Reichl, Herbert
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
A comparison of thin film polymers for Wafer Level Packaging
Töpper, Michael, Fischer, Thorsten, Baumgartner, Tobias, Reichl, Herbert
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Recent Developments in Panel Level Packaging
Braun, Tanja, Billaud, Mathilde, Zedel, Hannes, Stobbe, Lutz, Becker, Karl-Friedrich, Hoelck, Ole, Wohrmann, Markus, Boettcher, Lars, Topper, Michael, Aschenbrenner, R., Voges, Steve, Lang, Klaus-Dieter, Schneider-Ramelow, Martin
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
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Conference Proceeding
Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multi-layer Routing with 10 µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging
Woehrmann, Markus, Hichri, Habib, Gernhardt, Robert, Hauck, Karin, Braun, Tanja, Toepper, Michael, Arendt, Markus, Lang, Klaus-Dieter
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Woehrmann, Markus, Fischer, Thorsten, Walter, Hans, Toepper, Michael, Lang, Klaus-Dieter
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Potential and challenges of fan-out panel level packaging
Braun, Tanja, Becker, Karl-Friedrich, Kahle, Ruben, Raatz, Stefan, Topper, Michael, Aschenbrenner, Rolf, Voges, Steve, Wohrmann, Markus, Lang, Klaus-Dieter
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael, Wohrman, Markus, Brusberg, Lars, Jurgensen, Nils, Ndip, Ivan, Lang, Klaus-Dieter
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, Ulli, Maus, Simon, Topper, Michael
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Single-mode board-level interconnects for silicon photonics
Brusberg, Lars, Manessis, Dionysios, Herbst, Christian, Neitz, Marcel, Schild, Beatrice, Topper, Michael, Schroder, Henning, Tekin, Tolga
Published in 2015 Optical Fiber Communications Conference and Exhibition (OFC) (01.03.2015)
Published in 2015 Optical Fiber Communications Conference and Exhibition (OFC) (01.03.2015)
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Conference Proceeding