Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
Tiedje, Tobias, Brauer, Christoph, Luniak, Marco, Nieweglowski, Krzysztof, Bock, Karlheinz
Published in Journal of microelectronics and electronic packaging (01.01.2024)
Published in Journal of microelectronics and electronic packaging (01.01.2024)
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Journal Article
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
Nieweglowski, Krzysztof, Lorenz, Lukas, Lüngen, Sebastian, Tiedje, Tobias, Wolter, Klaus-Jürgen, Bock, Karlheinz
Published in Microelectronics and reliability (01.05.2018)
Published in Microelectronics and reliability (01.05.2018)
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Journal Article
Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?
Tiedje, Tobias, Lungen, Sebastian, Nieweglowski, Krzysztof, Bock, Karlheinz
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Reliability of 3D additive manufactured packages
Lungen, Sebastian, Tiedje, Tobias, Meier, Karsten, Nieweglowski, Krzysztof, Bock, Karlheinz
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?
Tiedje, Tobias, Lungen, Sebastian, Schubert, Martin, Luniak, Marco, Nieweglowski, Krzysztof, Bock, Karlheinz
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level Integration
Lungen, Sebastian, Tiedje, Tobias, Nieweglowski, Krzysztof, Lorenz, Lukas, Bock, Karlheinz, Charania, Sujay, Killge, Sebastian, Bartha, Johann
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
METHOD AND DEVICE FOR EMBEDDING AT LEAST ONE ELECTRONIC COMPONENT IN A SUBSTRATE
ELLINGER, Frank, NIEWEGLOWSKI, Krysztof, KLEIN, Bernhard, SEILER, Patrick Sascha, BOCK, Karl-Heinz, TIEDJE, Tobias, BETANCOURT, Diego, NEUMANN, Niels, PLETTEMEIER, Dirk, SCHUBERT, Martin, LÜNGEN, Sebastian
Year of Publication 18.12.2019
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Year of Publication 18.12.2019
Patent
METHOD AND DEVICE FOR EMBEDDING AT LEAST ONE ELECTRONIC COMPONENT IN A SUBSTRATE
ELLINGER, Frank, NIEWEGLOWSKI, Krysztof, KLEIN, Bernhard, SEILER, Patrick Sascha, BOCK, Karl-Heinz, TIEDJE, Tobias, BETANCOURT, Diego, NEUMANN, Niels, PLETTEMEIER, Dirk, SCHUBERT, Martin, LÜNGEN, Sebastian
Year of Publication 16.08.2018
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Year of Publication 16.08.2018
Patent
Verfahren und Vorrichtung zum Einbetten mindestens eines elektronischen Bauelements in einen Träger
Tiedje, Tobias, Betancourt, Diego, Ellinger, Frank, Bock, Karl-Heinz, Klein, Bernhard, Nieweglowski, Krzysztof, Lüngen, Sebastian, Plettemeier, Dirk, Schubert, Martin, Seiler, Patrick Sascha, Neumann, Niels
Year of Publication 09.08.2018
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Year of Publication 09.08.2018
Patent