Biosensing extracellular vesicles: contribution of biomolecules in affinity-based methods for detection and isolation
Gaillard, M, Thuaire, A, Nonglaton, G, Agache, V, Roupioz, Y, Raillon, C
Published in Analyst (London) (21.03.2020)
Published in Analyst (London) (21.03.2020)
Get full text
Journal Article
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
Frank, T., Moreau, S., Chappaz, C., Leduc, P., Arnaud, L., Thuaire, A., Chery, E., Lorut, F., Anghel, L., Poupon, G.
Published in Microelectronics and reliability (01.01.2013)
Published in Microelectronics and reliability (01.01.2013)
Get full text
Journal Article
Resistance increase due to electromigration induced depletion under TSV
Frank, T, Chappaz, C, Leduc, P, Arnaud, L, Lorut, F, Moreau, S, Thuaire, A, El Farhane, R, Anghel, L
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Get full text
Conference Proceeding
Forward-bias degradation in 4H-SiC p+nn+ diodes: Influence of the mesa etching
Camara, N., Thuaire, A., Bano, E., Zekentes, K.
Published in Physica status solidi. A, Applications and materials science (01.03.2005)
Published in Physica status solidi. A, Applications and materials science (01.03.2005)
Get full text
Journal Article
4H-SiC p–i–n diodes grown by sublimation epitaxy in vacuum (SEV) and their application as microwave diodes
Camara, N, Zekentes, K, Zelenin, V V, Abramov, P L, Kirillov, A V, Romanov, L P, Boltovets, N S, Krivutsa, V A, Thuaire, A, Bano, E, Tsoi, E, Lebedev, A A
Published in Semiconductor science and technology (01.02.2008)
Published in Semiconductor science and technology (01.02.2008)
Get full text
Journal Article
Investigation of the charge carrier concentration in highly aluminum doped SiC using Raman scattering
Müller, R., Künecke, U., Thuaire, A., Mermoux, M., Pons, M., Wellmann, P.
Published in Physica status solidi. C (01.03.2006)
Published in Physica status solidi. C (01.03.2006)
Get full text
Journal Article
Optical mapping of aluminum doped p-type SiC wafers
Wellmann, P. J., Straubinger, T., Künecke, U., Müller, R., Sakwe, S. A., Pons, M., Thuaire, A., Crisci, A., Mermoux, M., Auvray, L., Camassel, J.
Published in Physica status solidi. A, Applications and materials science (01.03.2005)
Published in Physica status solidi. A, Applications and materials science (01.03.2005)
Get full text
Journal Article
Investigation on TSV impact on 65nm CMOS devices and circuits
Chaabouni, H, Rousseau, M, Leduc, P, Farcy, A, El Farhane, R, Thuaire, A, Haury, G, Valentian, A, Billiot, G, Assous, M, De Crecy, F, Cluzel, J, Toffoli, A, Bouchu, D, Cadix, L, Lacrevaz, T, Ancey, P, Sillon, N, Flechet, B
Published in 2010 International Electron Devices Meeting (01.12.2010)
Published in 2010 International Electron Devices Meeting (01.12.2010)
Get full text
Conference Proceeding
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric : Reliability of Micro-Interconnects in 3D IC Packages
FRANK, T, MOREAU, S, CHAPPAZ, C, LEDUC, P, ARNAUD, L, THUAIRE, A, CHERY, E, LORUT, F, ANGHEL, L, POUPON, G
Published in Microelectronics and reliability (2013)
Get full text
Published in Microelectronics and reliability (2013)
Journal Article
Nanopackaging solution from clean room to UHV Environment: Hydrogen Passivated Si (100) Substrate Fabrication and Use for Atomic Scale Investigations and Self-Assembled Monolayer Grafting
Reynaud, P., Thuaire, A., Sordes, D., Rauer, C., Hartmann, J.M., Moriceau, H., Bhartia, B., Puniredd, S.R., Troadec, C., Srinivasan, M.P., Baillin, X., Cheramy, S.
Published in Procedia engineering (2016)
Published in Procedia engineering (2016)
Get full text
Journal Article
The electrochemical signature of functionalized single-walled carbon nanotubes bearing electroactive groups
Floch, Fabien Le, Thuaire, Aurélie, Bidan, Gérard, Simonato, Jean-Pierre
Published in Nanotechnology (08.04.2009)
Published in Nanotechnology (08.04.2009)
Get full text
Journal Article
Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking
Cadix, Lionel, Fuchs, Christine, Rousseau, Maxime, Leduc, Patrick, Chaabouni, Hamed, Thuaire, Aurelie, Brocard, Melanie, Valentian, Alexandre, Farcy, Alexis, Bermond, Cedric, Sillon, Nicolas, Ancey, Pascal, Fléchet, Bernard
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
Get full text
Journal Article
4H-SiC p-i-n diodes grown by sublimation epitaxy in vacuum (SEV) and their application as microwave diodes
CAMARA, N, ZEKENTES, K, TSOI, E, LEBEDEV, A. A, ZELENIN, V. V, ABRAMOV, P. L, KIRILLOV, A. V, ROMANOV, L. P, BOLTOVETS, N. S, KRIVUTSA, V. A, THUAIRE, A, BANO, E
Published in Semiconductor science and technology (2008)
Get full text
Published in Semiconductor science and technology (2008)
Journal Article
Electromigration behavior of 3D-IC TSV interconnects
Frank, T., Moreau, S., Chappaz, C., Arnaud, L., Leduc, P., Thuaire, A., Anghel, L.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding
Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs
Cadix, L., Rousseau, M., Fuchs, C., Leduc, P., Thuaire, A., El Farhane, R., Chaabouni, H., Anciant, R., Huguenin, J.-L., Coudrain, P., Farcy, A., Bermond, C., Sillon, N., Flechet, B., Ancey, P.
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Get full text
Conference Proceeding
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications
El Farhane, Rebha, Assous, M, Leduc, P, Thuaire, A, Bouchu, D, Feldis, H, Sillon, N
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Get full text
Conference Proceeding