Verpacken von Multi-Chip-Modulen ohne Drahtverbindung
DEGANI, YINON, DUDDERAR, THOMAS D, HAN, BYUNG J, TAI, KING L, LYONS, ALAN M
Year of Publication 12.02.2004
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Year of Publication 12.02.2004
Patent
Packaging multi-chip modules without wirebond interconnection
DEGANI, YINON, DUDDERAR, THOMAS D, HAN, BYUNG J, TAI, KING L, LYONS, ALAN M
Year of Publication 23.04.2003
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Year of Publication 23.04.2003
Patent