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Year of Publication 11.11.1998
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Packaging multi-chip modules without wire-bond interconnection
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Year of Publication 04.03.1997
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Packaging multi-chip modules without wirebond interconnection
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Year of Publication 28.08.1996
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Year of Publication 28.08.1996
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Year of Publication 29.05.1990
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Year of Publication 02.02.1971
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