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Published in 2021 IEEE International Reliability Physics Symposium (IRPS) (01.03.2021)
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Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
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Year of Publication 28.08.2009
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Structure to accommodate increase in volume expansion during solder reflow
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Year of Publication 21.09.2006
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Year of Publication 21.09.2006
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