Fin Doping by Hot Implant for 14nm FinFET Technology and Beyond
Wood, Bingxi Sun, Khaja, Fareen Adeni, Colombeau, Benjamin P, Sun, Shiyu, Waite, Andrew, Jin, Miao, Chen, Hao, Chan, Osbert, Thanigaivelan, Thirumal, Pradhan, Nilay, Gossmann, Hans-Joachim L, Sharma, Shashank, Chavva, Venkataramana R, Cai, Man-Ping, Okazaki, Motoya, Munnangi, Samuel Swaroop, Ni, Chi-Nung, Suen, Wesley, Chang, Chorng-Ping, Mayur, Abhilash, Variam, Naushad, Brand, Adam D
Published in ECS transactions (31.08.2013)
Published in ECS transactions (31.08.2013)
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Journal Article
Cold Silicon Preamorphization Implant and Presilicide Sulfur Implant for Advanced Nickel Silicide Contacts
Tong, Yi, Zhou, Qian, Low, Kain Lu, Wang, Lan Xiang, Chua, Lye Hing, Thanigaivelan, Thirumal, Henry, Todd, Yeo, Yee-Chia
Published in IEEE transactions on electron devices (01.10.2014)
Published in IEEE transactions on electron devices (01.10.2014)
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Journal Article
Contact Resistance Reduction for Strained N-MOSFETs With Silicon-Carbon Source/Drain Utilizing Aluminum Ion Implant and Aluminum Profile Engineering
Qian Zhou, Shao-Ming Koh, Thanigaivelan, T., Henry, T., Yee-Chia Yeo
Published in IEEE transactions on electron devices (01.04.2013)
Published in IEEE transactions on electron devices (01.04.2013)
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Journal Article
Impact of a Germanium and Carbon Preamorphization Implant on the Electrical Characteristics of NiSi/Si Contacts With a Presilicide Sulfur Implant
Yi Tong, Qian Zhou, Chua, L. H., Thanigaivelan, T., Henry, T., Yee-Chia Yeo
Published in IEEE electron device letters (01.12.2011)
Published in IEEE electron device letters (01.12.2011)
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Journal Article
Novel Scanning Nanosecond Laser Anneal with Variable Dwell and Real-time Process Control for Advanced Logic and Memory Applications
Kassim, Joseph, Willemann, Michael, Khaja, Fareen, Thanigaivelan, Thirumal
Published in 2023 21st International Workshop on Junction Technology (IWJT) (08.06.2023)
Published in 2023 21st International Workshop on Junction Technology (IWJT) (08.06.2023)
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Conference Proceeding
OPTIMIZED HALO OR POCKET COLD IMPLANTS
RODIER DENNIS, THANIGAIVELAN THIRUMAL, HATEM CHRISTOPHER R, SHIM, KYU HA, COLOMBEAU BENJAMIN
Year of Publication 31.05.2012
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Year of Publication 31.05.2012
Patent
Benefits of Zero Degree Single Wafer High Energy Implants for Advanced Semiconductor Device Fabrication
Lee, Woojin, Thanigaivelan, Thirumal, Gossmann, Hans-Joachim, Low, Russell, Colombeau, Benjamin, Lacey, Kerry, Merrill, Mark, Renau, Anthony
Published in Ion Implantation Technology 2008 (01.01.2008)
Published in Ion Implantation Technology 2008 (01.01.2008)
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Journal Article
External Resistance Reduction by Nanosecond Laser Anneal in Si/SiGe CMOS Technology
Gluschenkov, Oleg, Wu, Heng, Brew, Kevin, Niu, Chengyu, Yu, Lan, Sulehria, Yasir, Choi, Samuel, Durfee, Curtis, Demarest, James, Carr, Adra, Chen, Shaoyin, Willis, Jim, Thanigaivelan, Thirumal, Lie, Fee-li, Kleemeier, Walter, Guo, Dechao
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
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Conference Proceeding
VIISta 900 3D: Advanced medium current implanter
Sinclair, Frank, Olson, Joe, Rodier, Dennis, Eidukonis, Alex, Thanigaivelan, Thirumal, Todorov, Stan
Published in 2014 20th International Conference on Ion Implantation Technology (IIT) (01.06.2014)
Published in 2014 20th International Conference on Ion Implantation Technology (IIT) (01.06.2014)
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Conference Proceeding
Fin Doping By Hot Implant for 14nm Finfet Technology and Beyond
Wood, Bingxi Sun, Khaja, Fareen Adeni, Colombeau, Benjamin P, Sun, Shiyu, Waite, Andrew, Jin, Miao, Chen, Hao, Chan, Osbert, Thanigaivelan, Thirumal, Pradhan, Nilay, Gossmann, Hans-Joachim L, Ni, Chi-Nung, Suen, Wesley, Sharma, Shashank, Chavva, Venkataramana R, Cai, Man-Ping, Okazaki, Motoya, Munnangi, Samuel Swaroop, Chang, Chorng-Ping, Mayur, Abhilash, Variam, Naushad, Brand, Adam D
Published in Meeting abstracts (Electrochemical Society) (27.10.2013)
Published in Meeting abstracts (Electrochemical Society) (27.10.2013)
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Journal Article
Novel technique to engineer aluminum profile at nickel-silicide/Silicon:Carbon interface for contact resistance reduction, and integration in strained N-MOSFETs with silicon-carbon stressors
Shao-Ming Koh, Qian Zhou, Thanigaivelan, T., Henry, T., Samudra, G. S., Yee-Chia Yeo
Published in 2011 International Electron Devices Meeting (01.12.2011)
Published in 2011 International Electron Devices Meeting (01.12.2011)
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Conference Proceeding
Precision ion implantation: A critical tool for advanced device processing
Gossmann, H.-J.L., Thanigaivelan, T., Hatem, C.
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01.10.2008)
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01.10.2008)
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Conference Proceeding