Interfacial structures between aluminum nitride and Cu–P–Sn–Ni brazing alloy with Ti film
Terasaki, Nobuyuki, Kon, Naochika, Chiba, Hajime, Ohashi, Touyou, Nagatomo, Yoshiyuki, Kuromitsu, Yoshirou, Knowles, Kevin M.
Published in Journal of materials science (01.05.2021)
Published in Journal of materials science (01.05.2021)
Get full text
Journal Article
A new transient liquid phase bonding method using magnesium foil to bond copper plates to aluminum nitride substrates
Takakuwa, Satoshi, Terasaki, Nobuyuki, Kon, Naochika, Ohashi, Touyou, Nita, Nobuyasu, Nagatomo, Yoshiyuki, Kuromitsu, Yoshirou
Published in Journal of materials science. Materials in electronics (01.05.2022)
Published in Journal of materials science. Materials in electronics (01.05.2022)
Get full text
Journal Article
Effect of interfacial structure on peel strength between Cu and AlN bonded with a Mg–Ti co-deposited film
Terasaki, Nobuyuki, Kon, Naochika, Chiba, Hajime, Ohashi, Touyou, Sekino, Tohru
Published in Discover materials (01.12.2023)
Published in Discover materials (01.12.2023)
Get full text
Journal Article
Interfacial structure between TiN sintered ceramics with and without an Fe-containing grain boundary phase and Ag–Cu eutectic brazing filler material
Terasaki, Nobuyuki, Kon, Naochika, Chiba, Hajime, Ohashi, Touyou, Sekino, Tohru
Published in SN applied sciences (01.01.2023)
Published in SN applied sciences (01.01.2023)
Get full text
Journal Article
Atomic structures of a liquid-phase bonded metal/nitride heterointerface
Kumamoto, Akihito, Shibata, Naoya, Nayuki, Kei-Ichiro, Tohei, Tetsuya, Terasaki, Nobuyuki, Nagatomo, Yoshiyuki, Nagase, Toshiyuki, Akiyama, Kazuhiro, Kuromitsu, Yoshirou, Ikuhara, Yuichi
Published in Scientific reports (10.03.2016)
Published in Scientific reports (10.03.2016)
Get full text
Journal Article