Exploring the Single Atom Spin State by Electron Spectroscopy
Lin, Yung-Chang, Teng, Po-Yuan, Chiu, Po-Wen, Suenaga, Kazu
Published in Physical review letters (13.11.2015)
Published in Physical review letters (13.11.2015)
Get more information
Journal Article
Three-fold rotational defects in two-dimensional transition metal dichalcogenides
Lin, Yung-Chang, Björkman, Torbjörn, Komsa, Hannu-Pekka, Teng, Po-Yuan, Yeh, Chao-Hui, Huang, Fei-Sheng, Lin, Kuan-Hung, Jadczak, Joanna, Huang, Ying-Sheng, Chiu, Po-Wen, Krasheninnikov, Arkady V., Suenaga, Kazu
Published in Nature communications (02.04.2015)
Published in Nature communications (02.04.2015)
Get full text
Journal Article
Remote Catalyzation for Direct Formation of Graphene Layers on Oxides
Teng, Po-Yuan, Lu, Chun-Chieh, Akiyama-Hasegawa, Kotone, Lin, Yung-Chang, Yeh, Chao-Hui, Suenaga, Kazu, Chiu, Po-Wen
Published in Nano letters (14.03.2012)
Published in Nano letters (14.03.2012)
Get full text
Journal Article
Unexpected Huge Dimerization Ratio in One-Dimensional Carbon Atomic Chains
Lin, Yung-Chang, Morishita, Shigeyuki, Koshino, Masanori, Yeh, Chao-Hui, Teng, Po-Yuan, Chiu, Po-Wen, Sawada, Hidetaka, Suenaga, Kazutomo
Published in Nano letters (11.01.2017)
Published in Nano letters (11.01.2017)
Get full text
Journal Article
Structural and Chemical Dynamics of Pyridinic-Nitrogen Defects in Graphene
Lin, Yung-Chang, Teng, Po-Yuan, Yeh, Chao-Hui, Koshino, Masanori, Chiu, Po-Wen, Suenaga, Kazu
Published in Nano letters (11.11.2015)
Published in Nano letters (11.11.2015)
Get full text
Journal Article
Generalizable Deep Neural Network Based Multi-Material Hysteresis Modeling
Khan, Arbaaz, Ceesay, Saikou, Teng, Yuan-Po, Wang, Ruoli, Yue, Haipeng, Lowther, David
Published in 2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation-Long papers (CEFC-LONG) (01.10.2022)
Published in 2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation-Long papers (CEFC-LONG) (01.10.2022)
Get full text
Conference Proceeding
Gigahertz Field-Effect Transistors with CMOS-Compatible Transfer-Free Graphene
Yeh, Chao-Hui, Teng, Po-Yuan, Chiu, Yu-Chiao, Hsiao, Wen-Ting, Hsu, Shawn S. H, Chiu, Po-Wen
Published in ACS applied materials & interfaces (13.02.2019)
Published in ACS applied materials & interfaces (13.02.2019)
Get full text
Journal Article
Fully Transparent Resistive Memory Employing Graphene Electrodes for Eliminating Undesired Surface Effects: EMERGING GRAPHENE-BASED ELECTRONIC & PHOTONIC DEVICES, CIRCUITS, AND SYSTEMS
YANG, Po-Kang, CHANG, Wen-Yuan, TENG, Po-Yuan, JENG, Shuo-Fang, LIN, Su-Jien, CHIU, Po-Wen, HE, Jr-Hau
Published in Proceedings of the IEEE (2013)
Get full text
Published in Proceedings of the IEEE (2013)
Journal Article
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
SONG, RUI-WEN, Liu, Chia-Hung, Chen, Shih-Wei, Teng, Po-Yuan, Tsai, Hao-Yi
Year of Publication 12.09.2024
Get full text
Year of Publication 12.09.2024
Patent
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
Kuo, Tin-Hao, Yu, Chen-Hua, Pan, Kuo Lung, Lai, Yu-Chia, Teng, Po-Yuan, Tsai, Hao-Yi
Year of Publication 24.10.2024
Get full text
Year of Publication 24.10.2024
Patent
Packages with thick RDLs and thin RDLs stacked alternatingly
Kuo, Tin-Hao, Yu, Chen-Hua, Pan, Kuo Lung, Lai, Yu-Chia, Teng, Po-Yuan, Tsai, Hao-Yi
Year of Publication 06.08.2024
Get full text
Year of Publication 06.08.2024
Patent
Package structure and method of manufacturing the same
Pan, Kuo-Lung, Kuo, Tin-Hao, Lai, Chi-Hui, Chen, Shih-Wei, Tsai, Hao-Yi, Teng, Po-Yuan
Year of Publication 11.06.2024
Get full text
Year of Publication 11.06.2024
Patent
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF
Tseng, Ying-Cheng, Pan, Kuo-Lung, Kuo, Tin-Hao, Lai, Chi-Hui, Teng, Po-Yuan, Tsai, Hao-Yi, Hsu, Sen-Kuei, Lei, Yi-Yang
Year of Publication 10.10.2024
Get full text
Year of Publication 10.10.2024
Patent
3D Stacking Structure and Method of Fabricating the Same
Liu, Tzuan-Horng, Weng, Chung-Ming, Hsu, Che-Hsiang, Yu, Tsung-Yuan, Su, An-Jhih, Tsai, Hao-Yi, Teng, Po-Yuan
Year of Publication 22.08.2024
Get full text
Year of Publication 22.08.2024
Patent
Package structure and manufacturing method of package structure thereof
Tseng, Ying-Cheng, Pan, Kuo-Lung, Kuo, Tin-Hao, Lai, Chi-Hui, Teng, Po-Yuan, Tsai, Hao-Yi, Hsu, Sen-Kuei, Lei, Yi-Yang
Year of Publication 30.07.2024
Get full text
Year of Publication 30.07.2024
Patent
Semiconductor device including heat dissipation structure and fabricating method of the same
Yu, Chen-Hua, Kuo, Tin-Hao, Yee, Kuo-Chung, Chen, Shih-Wei, Teng, Po-Yuan, Tsai, Hao-Yi
Year of Publication 04.07.2023
Get full text
Year of Publication 04.07.2023
Patent