Effects of Sterilization Cycles on PEEK for Medical Device Application
Kumar, Amit, Yap, Wai Teng, Foo, Soo Leong, Lee, Teck Kheng
Published in Bioengineering (Basel) (21.02.2018)
Published in Bioengineering (Basel) (21.02.2018)
Get full text
Journal Article
A pilot clinical study of developing an External Assist Targeting Device for rapid and precise renal calyx access during percutaneous nephrolithotomy
Wu, Qinghui, Esuvaranathan, Kesavan, Lee, Teck Kheng, Foo, Soo Leong, Chai, Jian Ping, Chiong, Edmund
Published in Asian Journal of Urology (01.07.2023)
Published in Asian Journal of Urology (01.07.2023)
Get full text
Journal Article
Fluxless flip chip bonding with joint-in-via architecture
Get full text
Journal Article
Conference Proceeding
Interfacial microstructures and kinetics of Au/SnAgCu
Lee, Teck Kheng, Zhang, Sam, Wong, C.C., Tan, A.C., Hadikusuma, Davin
Published in Thin solid films (10.05.2006)
Published in Thin solid films (10.05.2006)
Get full text
Journal Article
Conference Proceeding
A novel joint-in-via flip-chip chip-scale package
Teck Kheng Lee, Zhang, S., Wong, C.C., Tan, A.C.
Published in IEEE transactions on advanced packaging (01.02.2006)
Published in IEEE transactions on advanced packaging (01.02.2006)
Get full text
Journal Article
Trace-in-bump for flip chip applications
Teck Kheng Lee, Bok Leng Ser, Kumar, Amit
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Get full text
Conference Proceeding
A Novel and Self-Calibrating Weighing Sensor with Intelligent Peristaltic Pump Control for Real-Time Closed-Loop Infusion Monitoring in IoT-Enabled Sustainable Medical Devices
Kok, Chiang Liang, Ho, Chee Kit, Dai, Yuwei, Lee, Teck Kheng, Koh, Yit Yan, Chai, Jian Ping
Published in Electronics (Basel) (01.05.2024)
Published in Electronics (Basel) (01.05.2024)
Get full text
Journal Article
Resist defined bump with fluxless flip chip bonding for productivity and reliability
Lee Teck Kheng, Ser Bok Leng, Yan Guo Qiang, Tioh Beng Chuan
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Get full text
Conference Proceeding
Comparison of SLICF with C4 for flip chip bonding with Au, Cu, Pd and Ag studs with SAC solder
Lee Teck Kheng, Ser Bok Leng, Chong Wee Ling, Tun, Khin Sandar, Yan Guo Qiang
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Effects of moisture on reliability of gold and copper ball bonds
Breach, C D, Ng Hun Shen, Tee Wai Mun, Teck Kheng Lee, Holliday, R
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Get full text
Conference Proceeding
Moisture induced corrosion in gold and copper ball bonds
Breach, C D, Wai Mun Tee, Teck Kheng Lee, Holliday, R
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Get full text
Conference Proceeding