Stacked type semiconductor device and method of fabricating stacked type semiconductor device
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Year of Publication 13.04.2010
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Year of Publication 13.04.2010
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Stacked type semiconductor device and method of fabricating stacked type semiconductor device
Shinma, Yasuhiro, Onodera, Masanori, Meguro, Kouichi, Taya, Koji, Tanaka, Junji, Kasai, Junichi
Year of Publication 13.04.2010
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Year of Publication 13.04.2010
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Carrier for stacked type semiconductor device and method of fabricating the same
Onodera, Masanori, Kasai, Junichi, Meguro, Kouichi, Tanaka, Junji, Shinma, Yasuhiro, Taya, Koji
Year of Publication 05.01.2010
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Year of Publication 05.01.2010
Patent
Carrier for stacked type semiconductor device and method of fabricating the same
TAYA KOJI, TANAKA JUNJI, SHINMA YASUHIRO, KASAI JUNICHI, ONODERA MASANORI, MEGURO KOUICHI
Year of Publication 05.01.2010
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Year of Publication 05.01.2010
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
TAYA KOJI, HOSHINO MASATAKA, MASUDA NAOMI, SHINMA YASUHIRO, KASAI JUNICHI, MEGURO KOUICHI, ONODERA MASANORI, FUKUYAMA RYOTA
Year of Publication 31.12.2009
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Year of Publication 31.12.2009
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Semiconductor device and method of manufacturing the same
Hoshino, Masataka, Kasai, Junichi, Meguro, Kouichi, Fukuyama, Ryota, Shinma, Yasuhiro, Taya, Koji, Onodera, Masanori, Masuda, Naomi
Year of Publication 20.10.2009
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Year of Publication 20.10.2009
Patent
Semiconductor device and method of manufacturing the same
TAYA KOJI, HOSHINO MASATAKA, MASUDA NAOMI, SHINMA YASUHIRO, KASAI JUNICHI, MEGURO KOUICHI, ONODERA MASANORI, FUKUYAMA RYOTA
Year of Publication 20.10.2009
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Year of Publication 20.10.2009
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STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING
TAYA KOJI, HARAYAMA MASAHIKO, HOSHINO MASATAKA, MASUDA NAOMI, ONODERA MASANORI, FUKUYAMA RYOTA
Year of Publication 07.05.2009
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Year of Publication 07.05.2009
Patent
Carrier for stacked type semiconductor device and method of fabricating the same
YASUHIRO SHINMA, KOJI TAYA, KOUICHI MEGURO, JUNJI TANAKA, MASANORI ONODERA, JUNICHI KASAI
Year of Publication 11.02.2009
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Year of Publication 11.02.2009
Patent
Low-Cost Vacuum Molding Process for BGA Using a Large Area Substrate
Onodera, M., Meguro, K., Tanaka, J., Shinma, Y., Taya, K., Kasai, J.
Published in IEEE transactions on advanced packaging (01.11.2007)
Published in IEEE transactions on advanced packaging (01.11.2007)
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Journal Article
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
TAYA KOJI, HARAYAMA MASAHIKO, HOSHINO MASATAKA, MASUDA NAOMI, ONODERA MASANORI, FUKUYAMA RYOTA
Year of Publication 13.11.2008
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Year of Publication 13.11.2008
Patent