Advanced Low-Loss Photo-imageable Dielectric Material for RF/Millimeter-Wave Applications and Demonstration of High-Density Interconnect
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Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
Advanced Low-Loss and High-Density Photosensitive Dielectric Material for RF/Millimeter-Wave Applications
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Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
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Conference Proceeding
감광성 수지 조성물, 패턴을 갖는 수지막의 제조 방법, 패턴을 갖는 수지막, 및 반도체 회로 기판
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Year of Publication 02.04.2021
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Year of Publication 24.11.2017
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Year of Publication 24.11.2017
Patent
중합체, 수지 조성물 및 수지 성형체
NAWATE YUUYA, TATARA RYOJI, KITAMURA YUKI, UMEHARA TERUHIKO, KADOTA TOSHIAKI, MIYAKI NOBUYUKI
Year of Publication 22.11.2017
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Year of Publication 22.11.2017
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POLYMER, RESIN COMPOSITION, AND RESIN MOLDED ARTICLE
HATASE Kazuki, ANABUKI Shoma, KADOTA Toshiaki, HIFUMI Ryoyu, TATARA Ryoji, MIYAKI Nobuyuki
Year of Publication 29.09.2016
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Year of Publication 29.09.2016
Patent
POLYMER, RESIN COMPOSITION AND RESIN MOLDED BODY
KADOTA Toshiaki, KITAMURA Yuki, UMEHARA Teruhiko, NAWATE Yuuya, TATARA Ryoji, MIYAKI Nobuyuki
Year of Publication 15.09.2016
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Year of Publication 15.09.2016
Patent