Synthesis and Evaluation of novel PAGs for ArF Lithography
Kodama, Kunihiko, Sato, Kenichiro, Tan, Shiro, Nishiyama, Fumiyuki, Yamanaka, Tsukasa, Kanna, Shinnichi, Takahashi, Hyou, Kawabe, Yasumasa, Momota, Makoto, Kokubo, Tadayoshi
Published in Journal of Photopolymer Science and Technology (01.01.2004)
Published in Journal of Photopolymer Science and Technology (01.01.2004)
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Journal Article
A HFIPS-based Polymer Approach for 157 nm Single Layer Photoresist
Kanna, Shinichi, Mizutani, Kazuyoshi, Yasunami, Shoichiro, Kawabe, Yasumasa, Tan, Shiro, Yagihara, Morio, Kokubo, Tadayoshi, Malik, Sanjay, Dilocker, Stephanie
Published in Journal of Photopolymer Science and Technology (01.01.2003)
Published in Journal of Photopolymer Science and Technology (01.01.2003)
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Journal Article
Recent Advances in Acetal-Based BUY Resists
Malik, Sanjay, Blakeney, Andrew J., Ferreira, Lawrence, Maxwell, Brian, Driessche, Veerle van, Whewell, Allyn, Sarubbi, Thomas R., Bowden, Murrae J., Fujimori, Toru, Tan, Shiro, Aoai, Toshiaki, Uenishi, Kazuya, Kawabe, Yasumasa, Kokubo, Tadayoshi
Published in Journal of Photopolymer Science and Technology (1999)
Published in Journal of Photopolymer Science and Technology (1999)
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Journal Article
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
NAKAMURA ATSUSHI, IWAI YU, TAN SHIRO, KOYAMA ICHIRO, FUJIMAKI KAZUHIRO
Year of Publication 23.09.2014
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Year of Publication 23.09.2014
Patent
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
NAKAMURA ATSUSHI, IWAI YU, TAN SHIRO, KOYAMA ICHIRO, FUJIMAKI KAZUHIRO
Year of Publication 23.09.2014
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Year of Publication 23.09.2014
Patent
Copper-filled anodized aluminum oxide a potential material for low temperature bonding for 3D packaging
Yamashita, Kosuke, Hotta, Yoshinori, Kurooka, Shunji, Abe, Hirofumi, Tan, Shiro
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
Phommahaxay, Alain, Nakamura, Atsushi, Jourdain, Anne, Verbinnen, Greet, Kamochi, Yoshitaka, Koyama, Ichiro, Iwai, Yu, Sawano, Mitsuru, Tan, Shiro, Miller, A., Beyer, Gerald, Sleeckx, E., Beyne, Eric
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding