Copper wire bond reliability evaluation using a modular test chip
Trigg, A. D., Chai Tai Chong, Fen, S. Y. P., Kwee, J. L. T., Ming, C. C. H., Mung, S. C. S., Ping, C., Ganesh, V. P., Low, B., Chu, T. L., Leng, E. P.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding
Central neuromechanisms underlying control of intragastric pressure through acupuncture at Zusanli（ST36） in rats： the upper cervical cord is the key link between the ascending and descending pathways
Chun-yan Yong Shu Chen Heng Chen Xiao Chu Chao Zhang Cheng Tan Lan Ye Jiang-shan Li
Published in 中国神经再生研究：英文版 (2016)
Get full text
Published in 中国神经再生研究：英文版 (2016)
Journal Article