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"TAN CHER KHNG VICTOR"
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"TAN CHER KHNG VICTOR"
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Method for packaging microelectronic devices
by
TAY WUU YEAN
,
TAN CHER KHNG VICTOR
Year of Publication
13.07.2010
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Method for packaging microelectronic devices
by
Tay, Wuu Yean
,
Tan
,
Cher Khng Victor
Year of Publication
13.07.2010
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Methods of forming semiconductor assemblies
by
Lee, Teck Kheng
,
Tan
,
Cher Khng Victor
Year of Publication
04.08.2009
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Methods of forming semiconductor assemblies
by
LEE TECK KHENG
,
TAN CHER KHNG VICTOR
Year of Publication
04.08.2009
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Method for fabricating semiconductor package with multi-layer die contact and external contact
by
′Khng, Victor Tan Cher
,
Chai, Lee Kian
Year of Publication
23.06.2009
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Method for fabricating semiconductor package with multi-layer die contact and external contact
by
KHNG VICTOR TAN CHER
,
CHAI LEE KIAN
Year of Publication
23.06.2009
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MICROELECTRONIC DEVICES AND METHODS FOR PACKAGING MICROELECTRONIC DEVICES
by
KHNG VICTOR TAN CHER
,
YEAN TAY WUU
Year of Publication
28.12.2007
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Method for fabricating semiconductor package with multi-layer metal bumps
by
'Khng, Victor Tan Cher
,
Chai, Lee Kian
Year of Publication
07.08.2007
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Method for fabricating semiconductor package with multi-layer metal bumps
by
KHNG VICTOR TAN CHER
,
CHAI LEE KIAN
Year of Publication
07.08.2007
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Semiconductor die packages with recessed interconnecting structures
by
LEE TECK KHENG
,
TAN CHER KHNG VICTOR
Year of Publication
12.06.2007
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Semiconductor die packages with recessed interconnecting structures
by
Lee, Teck Kheng
,
Tan
,
Cher Khng Victor
Year of Publication
12.06.2007
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Microelectronic devices and methods for packaging microelectronic devices
by
KHNG VICTOR TAN CHER
,
YEAN TAY WUU
Year of Publication
07.06.2007
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Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
by
Cher
'
Khng
,
Victor Tan
,
Chai, Lee Kian
Year of Publication
24.04.2007
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Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
by
CHER
'
KHNG VICTOR TAN
,
CHAI LEE KIAN
Year of Publication
24.04.2007
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Semiconductor package having substrate with multi-layer metal bumps
by
'Khng, Victor Tan Cher
,
Chai, Lee Kian
Year of Publication
10.04.2007
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Semiconductor package having substrate with multi-layer metal bumps
by
KHNG VICTOR TAN CHER
,
CHAI LEE KIAN
Year of Publication
10.04.2007
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Microelectronic devices
by
Yean, Tay Wuu
,
Khng
,
Victor Tan Cher
Year of Publication
05.12.2006
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Microelectronic devices
by
KHNG VICTOR TAN CHER
,
YEAN TAY WUU
Year of Publication
05.12.2006
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Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
by
Lee, Teck Kheng
,
Tan
,
Cher Khng Victor
Year of Publication
26.09.2006
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Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
by
LEE TECK KHENG
,
TAN CHER KHNG VICTOR
Year of Publication
26.09.2006
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