by Lau, John H., Ming Li, Dewen Tian, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Yiu Ming Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Taylor, Thomas, Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Jiang Ran, Cao Xi, Koh Sau Wee, Qingxiang Yong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)

by Lau, John H., Ming Li, Li Qingqian, Margie, Chen, Tony, Xu, Iris, Qing Xiang Yong, Zhong Cheng, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Lo, Penny, Wu Kai, Ji Hao, Koh Sau Wee, Jiang Ran, Cao Xi, Beica, Rozalia, Sze Pei Lim, Lee, N. C., Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Mian Tao, Lo, Jeffery, Lee, Ricky S. W.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2018)

by Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, Eric, Kai, Wu, Cheung, Yiu-Ming, Ng, Eric, Xi, Cao, Ran, Jiang, Yang, Henry, Chen, Y. H., Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2018)

by Lau, John H., Li, Ming, Yang, Lei, Li, Margie, Xu, Iris, Chen, Tony, Chen, Sandy, Yong, Qing Xiang, Madhukumar, Janardhanan Pillai, Kai, Wu, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Bao, Winsons, Lim, Sze Pei, Beica, Rozalia, Ko, Cheng-Ta, Xi, Cao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2018)

by Cheng-Ta Ko, Yang, Henry, Lau, John H., Ming Li, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Qing Xiang Yong, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Wu Kai, Ji Hao, Beica, Rozalia, Lin, Marc, Yu-Hua Chen, Zhong Cheng, Koh Sau Wee, Jiang Ran, Cao Xi, Sze Pei Lim, Lee, N. C., Mian Tao, Lo, Jeffery, Lee, Ricky S. W.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2018)

by Guo, Hong-Yan, Zhang, Li, Tan, Kim-Hwee, Lai, Chi-Ming
Published in ECS transactions (27.02.2014)

by Guo Hongyan, Long Xinjiang, Hua Xuan, Zhang Li, Tan Kim Hwee, Lai Cm
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)

by Lau, John, Ming Li, Tian, Dewen, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Ken Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Cheng-Ta Ko, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Koh Sau Wee, Ran, Jiang, Xi, Cao
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Zhen, Hu, Wei, Zhao, Xiao, Gu, Dong, Chen, Haijie, Chen, Hong, Xu, Tan, Kim Hwee
Published in Journal of microelectronics and electronic packaging (01.09.2022)

by Lau, John, Li, Ming, Xu, Iris, Chen, Tony, Tan, Kim Hwee, Li, Zhang, Fan, Nelson, Kuah, Eric, So, Raymond, Lo, Penny, Cheung, Y. M., Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)

by Lau, John, Li, Ming, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Chen, Tony, Xu, Iris, Li, Margie, Cheung, Y. M., Kai, Wu, Hao, Ji, Beica, Rozalia, Taylor, Tom, Ko, CT, Yang, Henry, Chen, Y. H., Lim, Sze Pei, Lee, N. C., Ran, Jiang, Wee, Koh Sau, Yong, Qingxiang, Xi, Cao, Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in Journal of microelectronics and electronic packaging (01.10.2017)

by Ko, Cheng-Ta, Yang, Henry, Lau, John, Li, Ming, Li, Margie, Lin, Curry, Lin, J. W., Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Chen, Yu-Hua, Chen, Tony, Xu, Iris, Lo, Penny, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Lin, Chia-Hung, Beica, Rozalia, Lin, Marc, Xi, Cao, Lim, Sze Pei, Lee, Ning Cheng, Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in Journal of microelectronics and electronic packaging (01.10.2018)

by Asen Long Xin Jiang, Lai Chih Ming, Jeff Chen Yi Gao, Tan Kim Hwee
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)

by Asen Long Xin Jiang, Lai Chih Ming, Jeff Chen Yi Gao, Tan Kim Hwee
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)

by Lau, John, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y.M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Beica, Rozalia, Wee, Koh Sau, Li, Ming, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky, Yang, Lei, Li, Margie, Yong, Qing Xiang, Cheng, Zhong, Chen, Tony, Xu, Iris, Fan, Nelson
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Lin, Curry, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Lo, Penny, So, R., Chen, Y. H., Fan, Nelson, Kuah, Eric, Lin, Marc, Cheung, Y. M., Ng, Eric, Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)

by Lau, John, Kai, Wu, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Bao, Winsons, Lim, Sze Pei, Beica, Rozalia, Ko, C.T., Xi, Cao, Li, Ming, Lei, Yang, Li, Margie, Xu, Iris, Chen, Tony, Chen, Sandy, Yong, Qing Xiang, Janardhanan, Kumar
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Lau, John, Li, Zhang, Tan, Kim Hwee, Cheung, Y.M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Wee, Koh Sau, Ran, Jiang, Xi, Cao, Li, Ming, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky, Li, Margie, Chen, Tony, Xu, Iris, Yong, Qing Xiang, Cheng, Zhong, Fan, Nelson, Kuah, Eric
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Ko, Cheng-Ta, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Yong, Qing Xiang, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y. M., Ng, Eric, Yang, Henry, Kai, Wu, Hao, Ji, Beica, Rozalia, Lin, Marc, Chen, Y.H., Cheng, Zhong, Wee, Koh Sau, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lau, John, Lee, N.C., Tao, Mian, Lo, Jeffery, Lee, Ricky, Li, Ming, Li, Margie, Lin, Curry, Lin, J.W., Chen, Tony, Xu, Iris
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Hamamoto, Mitchell M, Chen, Yi Gao, Tan, Kim Hwee
Year of Publication 15.11.2011