Overview of Cultivation, Scientific Research, and Industrialization of Chinese Pomegranate
Cao, Shang-yin, Li, Haoxian, Niu, juan, Yuan, Pinli, Tan, Hong-hua, Zhao, Diguang, Zhang, Fuhong
Published in Acta horticulturae (01.01.2015)
Published in Acta horticulturae (01.01.2015)
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Journal Article
Progress on Soft Seed Pomegranate of China
Niu, juan, Tan, Hong-hua, Cao, Shang-yin, Li, Haoxian, Yuan, Pinli, Zhao, Diguang, Zhang, Fuhong
Published in Acta horticulturae (01.01.2015)
Published in Acta horticulturae (01.01.2015)
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Journal Article
Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages
Tan Hua Hong, Beleran, J., Drake, K. Y. S., Wilson, O. P. L., Mehta, G., Librado, G., Zhang, X. R., Surasit, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
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Journal Article
Epalrestat protects against diabetic peripheral neuropathy by alleviating oxidative stress and inhibiting polyol pathway
Li, Qing-rong, Wang, Zhuo, Zhou, Wei, Fan, Shou-rui, Ma, Run, Xue, Li, Yang, Lu, Li, Ya-shan, Tan, Hong-li, Shao, Qing-hua, Yang, Hong-ying
Published in Neural regeneration research (01.02.2016)
Published in Neural regeneration research (01.02.2016)
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Journal Article
Solutions for 45/40nm ELK device integration into Flip Chip and Wire Bond packaging
Beleran, John, Tan Hua Hong, Wilson, Ong P L, Zhang, X R, Amurao, Gatbonton Librado, Mehta, Gaurav, Zhu, W H
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Die attach adhesives for 3D same-sized dies stacked packages
Ch, Toh, Gaurav, Mehta, Hong, Tan Hua, Pl, Ong Wilson
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Path to Support Development of Production and Operation of Big Grain Production Households Based on Investigation of Heilongjiang Province
Yang Xiu-li Wang Yu-qing Ji He-wen Yin Bao-hua Tan Hong-yu
Published in The journal of Northeast Agricultural University (01.12.2015)
Published in The journal of Northeast Agricultural University (01.12.2015)
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Journal Article
A nanosilica/exfoliated graphene composite film-modified electrode for sensitive detection of methyl parathion
Fu, Ju, Tan, Xiao-Hong, Li, Yao-Hua, Song, Xin-Jian
Published in Chinese chemical letters (01.09.2016)
Published in Chinese chemical letters (01.09.2016)
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Journal Article
Semiconductor packages and methods of packaging semiconductor devices
Chaowasakoo, Tanawan, Laylo, Alexander Lucero, Jaengkrajarng, Thanawat, Tan, Hua Hong
Year of Publication 25.07.2023
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Year of Publication 25.07.2023
Patent
Packaging Approach for Integrating 40/45-nm ELK Devices into Wire Bond and Flip-Chip Packages : Best-of-Session Papers from the 60th Electronic Components and Technology Conference
TAN HUA HONG, BELERAN, John, DRAKE, Koh Y. S, WILSON, Ong P. L, MEHTA, Gaurav, LIBRADO, Gatbonton, ZHANG, X. R, SURASIT, C
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
Journal Article
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
TAN, Hua Hong, JAENGKRAJARNG, Thanawat, CHAOWASAKOO, Tanawan, LAYLO, Alexander Lucero
Year of Publication 27.01.2022
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Year of Publication 27.01.2022
Patent
Semiconductor Device and Method of Making a Substrate with Improved Substrate Mounting Apparatus
Wu, Yao Hong, Lam, Wing Keung, Xian, Wei Ming, Tan, Hua Hong, Chow, Chee Kay, Cai, Zong Xiang
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
Patent
Conductive bonding layer with spacers between a package substrate and chip
Chaowasakoo, Tanawan, Laylo, Alexander Lucero, Jaengkrajarng, Thanawat, Tan, Hua Hong
Year of Publication 12.10.2021
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Year of Publication 12.10.2021
Patent
Semiconductor Device and Method of Making a Substrate with Improved Substrate Mounting Apparatus
Wu, Yao Hong, Lam, Wing Keung, Xian, Wei Ming, Tan, Hua Hong, Chow, Chee Kay, Cai, Zong Xiang
Year of Publication 25.04.2024
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Year of Publication 25.04.2024
Patent
System and method of cleaning and inspecting semiconductor die carrier
Lam, Wing Keung, Wu, Yao Hong, Xian, Wei Ming, Hu, Tao, Tan, Hua Hong, Cai, Zong Xiang
Year of Publication 02.04.2024
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Year of Publication 02.04.2024
Patent