Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects
Miyamoto, Ryo, Tamahashi, Kunihiro, Inami, Takashi, Sasajima, Yasushi, Onuki, Jin
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article
Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects
Inami, Takashi, Miyamoto, Ryo, Tamahashi, Kunihiro, Namekawa, Takashi, Ishikawa, Nobuhiro, Ito, Masahiko, Onuki, Jin
Published in Journal of the Electrochemical Society (01.01.2017)
Published in Journal of the Electrochemical Society (01.01.2017)
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Journal Article
Grain Size Distribution at the Bottom Region in Very Narrow Cu Interconnects
INAMI, Takashi, TAMAHASHI, Kunihiro, NAMEKAWA, Takashi, CHIBA, Akio, ONUKI, Jin
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.03.2016)
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.03.2016)
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Journal Article
Nano-Structure-Controlled Very Low Resistivity Cu Wires Formed by High Purity and Optimized Additives
Onuki, Jin, Tamahashi, Kunihiro, Inami, Takashi, Nagano, Takatoshi, Sasajima, Yasushi, Ikeda, Shuji
Published in IEEE journal of the Electron Devices Society (01.01.2018)
Published in IEEE journal of the Electron Devices Society (01.01.2018)
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Journal Article
Resistivity Reduction in Very Narrow Cu Wiring
Onuki, Jin, Sasajima, Yasushi, Tamahashi, Kunihiro, Ke, YiQing, Terada, Shohei, Hidaka, Kishio, Itoh, Shinji
Published in Journal of the Electrochemical Society (01.01.2013)
Published in Journal of the Electrochemical Society (01.01.2013)
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Journal Article
EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires
Ke, Y, Namekawa, T, Tamahashi, K, Inami, T, Onuki, J
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.04.2013)
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.04.2013)
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Journal Article
High-Temperature Cycle Durability of Superplastic Al-Zn Eutectoid Solder Joints With Stress Relaxation Characteristics for SiC Power Semiconductor Devices
Saito, Katsuaki, Tamahashi, Kunihiro, Inami, Takashi, Kobiyama, Mamoru, Sasajima, Yasushi, Onuki, Jin, Kawamata, Yuji
Published in IEEE electron device letters (01.02.2019)
Published in IEEE electron device letters (01.02.2019)
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Journal Article
Substrate temperature dependence of electrical and structural properties of Ru films
Nagano, Takatoshi, Inokuchi, Kazuya, Tamahashi, Kunihiro, Ishikawa, Nobuhiro, Sasajima, Yasushi, Onuki, Jin
Published in Thin solid films (31.10.2011)
Published in Thin solid films (31.10.2011)
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Journal Article
COPPER WIRING AND MANUFACTURING METHOD OF THE SAME
TAMAHASHI KUNIHIRO, ITO MASAHIKO, SHINOJIMA YASUSHI, INAMI TAKASHI, ONUKI HITOSHI
Year of Publication 13.09.2018
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Year of Publication 13.09.2018
Patent
MICRO AND NANO BUBBLE GENERATING METHOD GENERATING NOZZLE AND GENERATING DEVICE
TAMAHASHI KUNIHIRO, TACHIBANA YOSHIAKI, TACHIBANA KOUSUKE, SASAJIMA SOUZOU, HARADA KAORU, HONMA KYOKO, MATUMOTO YUUKI
Year of Publication 14.01.2019
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Year of Publication 14.01.2019
Patent
MICRO AND NANO BUBBLE GENERATING METHOD GENERATING NOZZLE AND GENERATING DEVICE
TAMAHASHI KUNIHIRO, TACHIBANA YOSHIAKI, TACHIBANA KOUSUKE, SASAJIMA SOUZOU, HARADA KAORU, HONMA KYOKO, MATUMOTO YUUKI
Year of Publication 04.04.2018
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Year of Publication 04.04.2018
Patent
Highly reliable high-temperature superplastic Al-Zn eutectoid solder joining with stress relaxation characteristics for next generation SiC power semiconductor devices
Onuki, Jin, Chiba, Akio, Kawakami, Mitsuo, Tamahashi, Kunihiro, Sugawara, Yoshitaka, Inami, Takashi, Kobiyama, Mamoru, Motohashi, Yoshinobu, Kawamata, Yuji
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01.05.2017)
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01.05.2017)
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Conference Proceeding
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD THEREOF, AND METHOD OF SEARCHING FOR LOW RESISTIVITY COPPER WIRING USED FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
TAMAHASHI KUNIHIRO, SHINOJIMA YASUSHI, NAGANO TAKATOSHI, CHIBA AKIO, ONUKI HITOSHI
Year of Publication 27.11.2014
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Year of Publication 27.11.2014
Patent
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRODUCTION METHOD THEREFOR, AND METHOD FOR SEARCHING FOR LOW-RESISTIVITY COPPER WIRING USED IN SAID SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
SASAJIMA, YASUSHI, NAGANO, TAKATOSHI, TAMAHASHI, KUNIHIRO, CHIBA, AKIO, ONUKI, JIN
Year of Publication 20.11.2014
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Year of Publication 20.11.2014
Patent