Gallium Nitride and Silicon Transistors on 300 mm Silicon Wafers Enabled by 3-D Monolithic Heterogeneous Integration
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Published in IEEE transactions on electron devices (01.12.2020)
Published in IEEE transactions on electron devices (01.12.2020)
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Journal Article
Organic Interposers Using Zero-Misalignment-Via Technology and Silicon Wafer Carriers for Large Area Wafer-Level Package Applications
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Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration
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Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process
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Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
THEN, Han Wui, RADOSAVLJEVIC, Marko, KOIRALA, Pratik, FISCHER, Paul B, TALUKDAR, Tushar, SWAN, Johanna M, GOMES, Wilfred, CHOI, Beomseok, THOMAS, Nicole K, ELSHERBINI, Adel A, CHAU, Robert S
Year of Publication 02.10.2024
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Year of Publication 02.10.2024
Patent
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
Karhade, Omkar, Liff, Shawna, Eid, Feras, Hibbeler, Lance C, Talukdar, Tushar, Li, Wenhao, Kabir, Mohammad Enamul, Elsherbini, Adel, Jun, Kimin, Krishnatreya, Bhaskar Jyoti, Pawashe, Chytra
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
Liff, Shawna, Karhade, Omkar, Swan, Johanna, Aleksov, Aleksandar, Seangatith, Jiraporn, Talukdar, Tushar, Strong, Veronica, Kabir, Mohammad Enamul, Elsherbini, Adel, Jun, Kimin
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A COMPOSITE CHIPLET
Karhade, Omkar, Liff, Shawna, Swan, Johanna, Niazi, Haris Khan, Eid, Feras, Brun, Xavier, Talukdar, Tushar, Kabir, Mohammad Enamul, Elsherbini, Adel, Jun, Kimin, Krishnatreya, Bhaskar Jyoti
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
Shi, Yi, Yoshihiro, Tomita, Niazi, Haris Khan, Eid, Feras, Zhang, Batao, Elsherbini, Adel A, Talukdar, Tushar, Li, Wenhao, Karhade, Omkar G, Krishnatreya, Bhaskar Jyoti
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
Patent
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
KARHADE, Omkar, LI, Wenhao, TALUKDAR, Tushar, LIFF, Shawna, KABIR, Mohammad Enamul, EID, Feras, KRISHNATREYA, Bhaskar Jyoti, ELSHERBINI, Adel, JUN, Kimin, PAWASHE, Chytra, HIBBELER, Lance C
Year of Publication 21.02.2024
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Year of Publication 21.02.2024
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3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS
BAN, Ibrahim, THEN, Han Wui, FISCHER, Paul B, KOIRALA, Pratik, TALUKDAR, Tushar, JUN, Kimin, NORDEEN, Paul
Year of Publication 24.03.2022
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Year of Publication 24.03.2022
Patent
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
THEN, Han Wui, RADOSAVLJEVIC, Marko, KOIRALA, Pratik, FISCHER, Paul B, TALUKDAR, Tushar, SWAN, Johanna M, GOMES, Wilfred, CHOI, Beomseok, THOMAS, Nicole K, ELSHERBINI, Adel A, CHAU, Robert S
Year of Publication 02.08.2023
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Year of Publication 02.08.2023
Patent
GALLIUM NITRIDE (GAN) LAYER TRANSFER FOR INTEGRATED CIRCUIT TECHNOLOGY
THEN, Han Wui, RADOSAVLJEVIC, Marko, FISCHER, Paul B, HAFEZ, Walid M, KOIRALA, Pratik, TALUKDAR, Tushar, DASGUPTA, Sansaptak, NAIR, Nityan, HOFF, Thomas, NORDEEN, Paul, MICHAELOS, Thoe, THOMAS, Nicole K
Year of Publication 14.06.2023
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Year of Publication 14.06.2023
Patent
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
Shi, Yi, Karhade, Omkar, Liff, Shawna, Brun, Xavier, Li, Wenhao, Kabir, Mohammad Enamul, Elsherbini, Adel, Tsunoda, Nagatoshi, Krishnatreya, Bhaskar Jyoti, Niazi, Haris Khan, Eid, Feras, Seangatith, Jiraporn, Talukdar, Tushar, Zhang, Botao
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
Patent