Search Results - "TAKEOKA YASUSHI" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate

Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate

by Toriyama, K., Takeoka, Y., Okamoto, K., Noma, H., Orii, Y.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)

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Conference Proceeding

Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA

Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA

by Nishi, Sayaka, Hisada, Takashi, Takeoka, Yasushi
Year of Publication 10.02.2009

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Patent

Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA

Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA

by NISHI SAYAKA, HISADA TAKASHI, TAKEOKA YASUSHI
Year of Publication 10.02.2009

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Patent