Analysis of the formation mechanism of coarse-dense structure of silver paste in die bonding
Ishihara, Shingo, Takemasa, Tetsu, Suganuma, Katsuaki, Kano, Junya
Published in Advanced powder technology : the international journal of the Society of Powder Technology, Japan (01.06.2021)
Published in Advanced powder technology : the international journal of the Society of Powder Technology, Japan (01.06.2021)
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Journal Article
Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip
Kim, Dongjin, Nagao, Shijo, Chen, Chuantong, Wakasugi, Naoki, Yamamoto, Yasuyuki, Suetake, Aiji, Takemasa, Tetsu, Sugahara, Tohru, Suganuma, Katsuaki
Published in IEEE transactions on power electronics (01.05.2021)
Published in IEEE transactions on power electronics (01.05.2021)
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Journal Article
Failure investigation of a Ag sinter-joining SiC power device under harsh cycling conditions
Zhang, Zheng, Chen, Chuantong, Suetake, Aiji, Takemasa, Tetsu, Hsieh, Ming-Chun, Liu, Yang, Suganuma, Katsuaki
Published in ECS transactions (01.10.2021)
Published in ECS transactions (01.10.2021)
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Journal Article
FLUX AND SOLDER PASTE
MIYAGI NANAKO, MASAKI TSUYOSHI, TAKEMASA TETSU, TAKAGI KAZUNOBU, HASHIMOTO YUTAKA, HAYAKAWA MEGUMI, KANEKO MUTSUKI, SAITO RYO, NAGAI TOMOKO
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
Patent
FLUX AND SOLDER PASTE
MIYAGI NANAKO, MASAKI TSUYOSHI, TAKEMASA TETSU, TAKAGI KAZUNOBU, HASHIMOTO YUTAKA, HAYAKAWA MEGUMI, KANEKO MUTSUKI, NAGAI TOMOKO, SAITO RYO
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
Patent
FLUX AND SOLDER PASTE
NAGAI Tomoko, KANEKO Mutsuki, TAKAGI Kazuyori, HASHIMOTO Yutaka, TAKEMASA Tetsu, MASAKI Tsuyoshi, MIYAGI Nanako, SAITO Ryo, HAYAKAWA Megumi
Year of Publication 25.01.2024
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Year of Publication 25.01.2024
Patent
FLUX AND SOLDER PASTE
NAGAI Tomoko, KANEKO Mutsuki, TAKAGI Kazuyori, HASHIMOTO Yutaka, TAKEMASA Tetsu, MASAKI Tsuyoshi, MIYAGI Nanako, SAITO Ryo, HAYAKAWA Megumi
Year of Publication 25.01.2024
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Year of Publication 25.01.2024
Patent
FLUX FOR SOLDER PASTE, SOLDER PASTE AND SOLDER JOINED BODY
MIYAGI NANAKO, TAKEMASA TETSU, HASHIMOTO YUTAKA, HAYASHIDA TORU, TAKAGI KAZUYORI, INABA KO
Year of Publication 26.05.2016
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Year of Publication 26.05.2016
Patent
FLUX FOR SOLDER PASTE, SOLDER PASTE, AND JOINED BODY
MIYAGI NANAKO, TAKEMASA TETSU, HASHIMOTO YUTAKA, HAYASHIDA TORU, TAKAGI KAZUYORI, INABA KO
Year of Publication 19.05.2016
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Year of Publication 19.05.2016
Patent