Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density
Kadoguchi, Takuya, Sakai, Tsubasa, Sei, Tsubasa, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki
Published in Journal of materials science. Materials in electronics (01.09.2017)
Published in Journal of materials science. Materials in electronics (01.09.2017)
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Self‐Healing Technology for Metallic Die Attach Materials in Electronics
Take, Naoya, Joshi, Shailesh N., Dede, Ercan M.
Published in Advanced engineering materials (01.08.2019)
Published in Advanced engineering materials (01.08.2019)
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Journal Article
Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls
Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki
Published in Journal of materials science (01.03.2017)
Published in Journal of materials science (01.03.2017)
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Journal Article
Highly thermostable joint of Cu/Ni plating/composite Sn–0.7Cu solder with added Cu balls for die attachment in power modules
Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki
Published in Journal of materials science. Materials in electronics (01.11.2018)
Published in Journal of materials science. Materials in electronics (01.11.2018)
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Journal Article
Sheet-Type Flexible Organic Active Matrix Amplifier System Using Pseudo-CMOS Circuits With Floating-Gate Structure
Yokota, T., Sekitani, T., Tokuhara, T., Take, N., Zschieschang, U., Klauk, H., Takimiya, K., Tsung-Ching Huang, Takamiya, M., Sakurai, T., Someya, T.
Published in IEEE transactions on electron devices (01.12.2012)
Published in IEEE transactions on electron devices (01.12.2012)
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