ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR PRODUCING SAME
ICHIMURA Takayuki, FUKUI Masato, NAKAZAWA Takashi, TAKAYAMA Tomoki, NARITOMI Kazuya
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Year of Publication 17.10.2024
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LAMINATE, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
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회로 접속용 접착 필름, 및 회로 접속 구조체 및 그 제조 방법
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Year of Publication 24.07.2023
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회로 접속용 접착제 필름, 무기 필러 함유 조성물, 및, 회로 접속 구조체 및 그 제조 방법
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Year of Publication 31.05.2023
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ADHESIVE FILM FOR CIRCUIT CONNECTION, COMPOSITION CONTAINING INORGANIC FILLER, CIRCUIT CONNECTION STRUCTURE AND METHOD OF MANUFACTURING SAME
ICHIMURA Takayuki, MORIYA Toshimitsu, FUKUI Masato, NAKAZAWA Takashi, TAKAYAMA Tomoki, SUZUKI Shohta, NARITOMI Kazuya, KOBAYASHI Ryohta
Year of Publication 31.03.2022
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Year of Publication 31.03.2022
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THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
TAKAYAMA, Tomoki, SUGENO, Yu, SAKAMOTO, Norihiko, OTSUKA, Kohei, FUJITA, Hiroaki, KATO, Tetsuya
Year of Publication 01.07.2021
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Year of Publication 01.07.2021
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Adhesive film for circuit connection, inorganic filler-containing composition, circuit connection structure, and method for producing same
NARITOMI KAZUYA, SUZUKI SHOTA, MORIYA TOSHIMITSU, KOBAYASHI RYOTA, ICHIMURA TAKAYUKI, TAKAYAMA TOMOKI, FUKUI MASATO, NAKAZAWA TAKASHI
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Year of Publication 27.06.2023
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Adhesive film for circuit connection, composition containing inorganic filler, circuit connection structure and method of manufacturing same
NAKAZAWA, TAKASHI, KOBAYASHI, RYOHTA, ICHIMURA, TAKAYUKI, TAKAYAMA, TOMOKI, MORIYA, TOSHIMITSU, FUKUI, MASATO, NARITOMI, KAZUYA, SUZUKI, SHOHTA
Year of Publication 01.04.2022
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Year of Publication 01.04.2022
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Thermosetting resin composition, prepreg, laminate, printed wiring board and semiconductor package
SAKAMOTO, NORIHIKO, FUJITA, HIROAKI, TAKAYAMA, TOMOKI, KATO, TETSUYA, OTSUKA, KOHEI, SUGENO, YU
Year of Publication 01.11.2021
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Year of Publication 01.11.2021
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