Evaluation of Materials for Fan-Out Panel Level Packaging (FOPLP) Applications
Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Yamamoto, Kazunori, Fujinaga, Tetsushi, Jono, Koichi, Matsui, Hiroshi, Yoshiteru, Takaya, Yukio, Horiguchi
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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