Search Results - "TAKANO Nozomu" :: K.UTB vyhledávací portál

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Analysis of structures of oligomeric siloxanes from dimethoxydimethylsilane under heat treatment by FT-IR

by TAKANO, Nozomu, FUKUDA, Tomio, ONO, Katsumichi
Published in Polymer journal (01.01.2001)

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Journal Article

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배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재

by TAKANO NOZOMU, OHKOSHI MASASHI, IZAWA HIROYUKI, KOTAKE TOMOHIKO, ITOH YUKA, FUJIMOTO DAISUKE, TAKAGI SHUNSUKE, AKAI KUNIHIKO
Year of Publication 25.07.2024

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Patent

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WIRING FORMING MEMBER, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMED MEMBER

by AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki
Year of Publication 18.07.2024

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Patent

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경화성 접착제 조성물, 필름상 접착제, 다층 배선 기판의 제조 방법 및 다층 배선 기판

by TAKANO NOZOMU, OHKOSHI MASASHI, IZAWA HIROYUKI, ITOH YUKA, AKAI KUNIHIKO, TAKAGI SHUNSUKE
Year of Publication 18.04.2024

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Patent

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도전성 부재, 전자 장치의 제조 방법, 접속 구조체,및, 전자 장치

by TAKANO NOZOMU, OHKOSHI MASASHI, IZAWA HIROYUKI, KOTAKE TOMOHIKO, FUJIMOTO DAISUKE, ITOH YUKA, AKAI KUNIHIKO, TAKAGI SHUNSUKE
Year of Publication 19.09.2023

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Patent

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MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER

by AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKAGI Shunsuke, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki, KOTAKE Tomohiko
Year of Publication 17.08.2023

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Patent

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MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER

by AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKAGI Shunsuke, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki, KOTAKE Tomohiko
Year of Publication 17.08.2023

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Patent

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MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER

by AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKAGI Shunsuke, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki, KOTAKE Tomohiko
Year of Publication 17.08.2023

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Patent

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MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER

by AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKAGI Shunsuke, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki, KOTAKE Tomohiko
Year of Publication 17.08.2023

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WIRING-FORMING MEMBER, WIRING LAYER FORMING METHOD USING WIRING-FORMING MEMBER, AND WIRING-FORMED MEMBER

by AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKAGI Shunsuke, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki, KOTAKE Tomohiko
Year of Publication 01.06.2023

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Patent

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부품 내장 기판의 제조 방법, 및, 부품 내장 기판

by TAKANO NOZOMU, OHKOSHI MASASHI, IZAWA HIROYUKI, MURAI HIKARI, ITOH YUKA, AKAI KUNIHIKO
Year of Publication 06.04.2023

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Patent

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배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재

by TAKANO NOZOMU, OHKOSHI MASASHI, IZAWA HIROYUKI, MURAI HIKARI, ITOH YUKA, AKAI KUNIHIKO
Year of Publication 04.04.2023

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Patent

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CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD

by AKAI Kunihiko, ITOH Yuka, TAKANO Nozomu, TAKAGI Shunsuke, OHKOSHI Masashi, IZAWA Hiroyuki
Year of Publication 23.02.2023

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Patent

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ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

by AKAI Kunihiko, FUJIMOTO Daisuke, OKOSHI Masashi, ITOH Yuka, TAKANO Nozomu, TAKAGI Shunsuke, IZAWA Hiroyuki, KOTAKE Tomohiko
Year of Publication 28.07.2022

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Patent

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Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

by Miyauchi, Kazuhiro, Yamashita, Yukihiko, Suzuki, Naoya, Takano, Nozomu
Published in Journal of electronic materials (01.09.2014)

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Journal Article

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MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER

by AKAI Kunihiko, OKOSHI Masashi, TAKANO Nozomu, IZAWA Hiroyuki, MURAI Hikari, ITOU Yuka
Year of Publication 10.02.2022

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Patent

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METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SUBSTRATE WITH BUILT-IN COMPONENTS

by AKAI Kunihiko, OKOSHI Masashi, TAKANO Nozomu, IZAWA Hiroyuki, MURAI Hikari, ITOU Yuka
Year of Publication 10.02.2022

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Patent

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NCF for wafer lamination process in higher density electronic packages

by Honda, Kazutaka, Enomoto, Tetsuya, Nagai, Akira, Takano, Nozomu
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)

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Conference Proceeding