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Year of Publication 24.03.2005
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Year of Publication 16.07.2008
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Year of Publication 05.01.2005
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Thermosetting resin composition with low thermal expansion and resin film
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Year of Publication 29.12.2004
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Year of Publication 15.09.2004
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THERMOSETTING RESIN COMPOSITION WITH LOW THERMAL EXPANSION AND RESIN FILM
TAKAHASHI, ATSUSHI, TAKANO, NOZOMU, BABA, HIDEO, MADARAME, KEN, NAKAKO, HIDEO
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Year of Publication 08.09.2004
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Thermosetting resin composition and use thereof
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Year of Publication 01.09.2004
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Multilayer wiring board
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Year of Publication 01.09.2012
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Thermosetting resin composition having low coefficient of thermal expansion and film using thereof
TAKAHASHI, ATSUSHI, TAKANO, NOZOMU, BABA, HIDEO, MADARAME, KEN, NAKAKO, HIDEO
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Year of Publication 21.06.2004
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Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Printed Wiring Board, and, Method for Manufacturing Multi-Layer Printed Wiring Board
TAKANO NOZOMU, TANAKA MASASHI, MATSUURA YOSHITSUGU, MASUDA KATSUYUKI, OBATA KAZUHITO, TAKEUCHI KAZUMASA, OOYAMA YUUJI
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Year of Publication 06.12.2007
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Year of Publication 13.05.2004
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Thermosetting resin composition and use thereof
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Year of Publication 13.05.2004
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Year of Publication 13.05.2004
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Thermosetting resin composition and use thereof
KOBAYASHI, KAZUHITO, MIZUNO, YASUYUKI, FUJIMOTO, DAISUKE, TSUCHIKAWA, SHINJI, TAKANO, NOZOMU
Year of Publication 11.04.2004
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Year of Publication 11.04.2004
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PREPREG FOR PRINTED WIRING BOARD, METAL FOIL CLAD LAMINATE AND PRINTED WIRING BOARD, AND, METHOD FOR MANUFACTURING MULTI-LAYER PRINTED WIRING BOARD
MASUDA, KATSUYUKI, TAKANO, NOZOMU, TAKEUCHI, KAZUMASA, TANAKA, MASASHI, OBATA, KAZUHITO, OOYAMA, YUUJI, MATSUURA, YOSHITSUGU
Year of Publication 08.08.2007
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Year of Publication 08.08.2007
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