Package Miniaturization and Wiring Impedance Reduction for High-bandwidth Memory Devices with Vertical Wire Bonding
Mochizuki, Keita, Wakioka, Hiroyuki, Fujita, Tsutomu, Shomura, Masatoshi, Maeda, Takeori, Ohda, Toshihiko, Muto, Yoshitaka, Takano, Eiji, Inohara, Masahiro
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Method of manufacturing semiconductor device
Shirono, Takashi, Fujii, Mika, Kume, Ippei, Takano, Eiji, Shima, Masaya, Shin, Eiichi
Year of Publication 13.10.2020
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Year of Publication 13.10.2020
Patent