Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages
Homma, Soichi, Shima, Masaya, Takano, Yuusuke, Watanabe, Takeshi, Murakami, Kazuhiro, Fukuda, Masatoshi, Imoto, Takashi, Nishikawa, Hiroshi
Published in Thin solid films (31.05.2022)
Published in Thin solid films (31.05.2022)
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Journal Article
Effect of Ar and N 2 plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding
Homma, Soichi, Shima, Masaya, Takano, Yuusuke, Watanabe, Takeshi, Fukuda, Masatoshi, Imoto, Takashi, Nishikawa, Hiroshi
Published in Journal of adhesion science and technology (18.03.2024)
Published in Journal of adhesion science and technology (18.03.2024)
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Journal Article
Effect of Ar and N2 plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding
Homma, Soichi, Shima, Masaya, Takano, Yuusuke, Watanabe, Takeshi, Fukuda, Masatoshi, Imoto, Takashi, Nishikawa, Hiroshi
Published in Journal of adhesion science and technology (18.03.2024)
Published in Journal of adhesion science and technology (18.03.2024)
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Journal Article