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"TAI KING LIEN"
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"TAI KING LIEN"
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LITHOGRAPHIC PROCESS
by
TAI KING LIEN
Year of Publication
11.10.1984
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Multi-chip ball grid array IC packages
by
TAI KING LIEN
,
DEGANI YINON
,
DUDDERAR THOMAS DIXON
Year of Publication
29.09.2001
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Flip chip packaging of memory chips
by
TAI
,
KING LIEN
,
DEGANI, YINON
,
DUDDERAR, THOMAS DIXON
Year of Publication
20.01.2016
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MCM with high Q overlapping resonator
by
TAI
,
KING LIEN
,
ZHAO, JINGSONG
Year of Publication
29.07.2009
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Circuit for providing interconnections among individual integrated circuit chips in a multi-chip module
by
TAI
,
KING LIEN
,
GABARA, THADDEUS JOHN
Year of Publication
13.08.2008
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Integrated passive devices
by
TAI KING LIEN
,
LAU MAUREEN Y
,
DEGANI YINON
Year of Publication
03.09.2009
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Integrated passive devices and method of manufacture
by
TAI
,
KING LIEN
,
DEGANI, YINON
,
LAU, MAUREEN Y
Year of Publication
01.04.2009
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RF IC package
by
TAI
,
KING LIEN
,
DEGANI, YINON
,
SMITH, PETER R
Year of Publication
15.10.2008
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Solder bonding printed circuit board
by
TAI
,
KING LIEN
,
DEGANI, YINON
Year of Publication
14.03.2001
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MCM with high Q overlapping resonator
by
TAI
,
KING LIEN
,
ZHAO, JINGSONG
Year of Publication
21.02.2001
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Solder bonding printed circuit boards
by
TAI
;
KING LIEN
,
DEGANI; YINON
Year of Publication
08.08.2000
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MCM with high Q overlapping resonator
by
TAI
;
KING LIEN
,
ZHAO; JINGSONG
Year of Publication
13.06.2000
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Verbesserte luftisolierte Kreuzungsstruktur
by
TAI
,
KING LIEN
,
REN, FAN
,
KOSSIVES, DEAN PAUL
Year of Publication
25.10.2007
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Multi-chip ball grid array ic packages
by
TAI
,
KING LIEN
,
DEGANI, YINON
,
DUDDERAR, THOMAS DIXON
Year of Publication
26.09.2007
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15
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Solder bonding printed circuit boards
by
TAI
;
KING LIEN
,
DEGANI; YINON
Year of Publication
11.01.2000
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Integrated passive devices
by
TAI KING LIEN
,
LAU MAUREEN Y
,
DEGANI YINON
Year of Publication
21.08.2007
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Integrated passive devices
by
Degani, Yinon
,
Lau, Maureen Y
,
Tai
,
King Lien
Year of Publication
21.08.2007
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Solder bonding printed circuit board
by
TAI
,
KING LIEN
,
DEGANI, YINON
Year of Publication
15.09.1999
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19
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Circuit and method for providing interconnections among individual integrated circuit chips in multi-chip module
by
KING LIEN TAI
,
THADDEUS JOHN GABARA
Year of Publication
07.01.2004
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Cellular and Wi-Fi communication devices integrated with a thin-film passive-component filter on an insulating substrate
by
TAI
,
KING LIEN
,
DEGANI, YINON
,
FAN, YU
,
GAO, CHARLEY CHUNLEI
,
SUN, LIGUO
,
SUN, KUNQUAN
Year of Publication
19.05.2010
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