System-in-package (SIP): challenges and opportunities
Tai, King L.
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
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Conference Proceeding
MULTI-CHIP MODULES PACKAGE
TAI KING L, INON DEGANI, DUDDERAR THOMAS D, HAN BYUNG J, LYONS ALAN M
Year of Publication 18.07.2003
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Year of Publication 18.07.2003
Patent
CLUSTER PACKAGING OF IC CHIPS IN MULTI-CHIP PACKAGES
JACALA JERICHO J, TAI KING L, GABARA THADDEUS JOHN, O'CONNOR KEVIN JOHN
Year of Publication 25.06.2001
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Year of Publication 25.06.2001
Patent
TESTER FOR ELECTRIC TESTING OF IC DEVICE
JACALA JERICHO J, TAI KING L, KOSSIVES DEAN PAUL, AHLQUIST LOUIS NELSON, DEGANI YINON
Year of Publication 15.06.2001
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Year of Publication 15.06.2001
Patent
Chip-scale modules for high-level integration in the 21st century
Gregus, Jeffrey A., Lau, Maureen Y., Degani, Yinon, Tai, King L.
Published in Bell Labs technical journal (01.07.1998)
Published in Bell Labs technical journal (01.07.1998)
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Journal Article
Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology
Wang, Michael X., Suzuki, Katsuharu, Dai, Wayne W.-M., Low, Yee L., O'conner, Kevin J., Tai, King L.
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
Published in Proceedings of the 2000 Asia and South Pacific Design Automation Conference (28.01.2000)
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Conference Proceeding
High Q-factor inductors integrated on MCM Si substrates
Zu, L., Yicheng Lu, Frye, R.C., Lau, M.Y., Chen, S.-C.S., Kossives, D.P., Jenshan Lin, Tai, K.L.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.08.1996)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.08.1996)
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Journal Article
Conference Proceeding
Ultra-Dense: an MCM-based 3-D digital signal processor
Segelken, J.M., Wu, L.J., Lau, M.Y., Tai, K.L., Shively, R.R., Grau, T.G.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1992)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1992)
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Journal Article
Chip-scale modules for high-level integration in the 21 super(st) century
Gregus, Jeffrey A, Lau, Maureen Y, Degani, Yinon, Tai, King L
Published in Bell Labs technical journal (01.07.1998)
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Published in Bell Labs technical journal (01.07.1998)
Journal Article
Silicon multichip modules: evolving a high performance technology from low-end applications
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Book Review
Journal Article