MEMS WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SMART CAP
WU IVAN HUA SHU, CHEN HSIANG FU, CHOU CHENG SAN, LIN CHIN MIN, HU FAN, LEE YI CHIA, TAI WEN CHUAN, SHEN CHING KAI
Year of Publication 05.06.2019
Get full text
Year of Publication 05.06.2019
Patent
Tdesign and fabrication of a three-dimensional long-stretch micro drive by electroplating
TAI, Wen-Chuan, WU, Chien-Tai, HSU, Chen-Peng, HSU, Wensyang
Published in 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest (2004)
Published in 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest (2004)
Get full text
Conference Proceeding
Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via
Huang, Jui-Cheng, Huang, Yu-Jie, Tai, Wen-Chuan, Chang, Allen Timothy
Year of Publication 22.10.2024
Get full text
Year of Publication 22.10.2024
Patent
Biosensor system with integrated microneedle
Huang, Jui-Cheng, Huang, Yu-Jie, Tai, Wen-Chuan, Chang, Allen Timothy
Year of Publication 22.10.2024
Get full text
Year of Publication 22.10.2024
Patent
BIOSENSOR SYSTEM WITH INTEGRATED MICRONEEDLE
Huang, Jui-Cheng, Huang, Yu-Jie, Tai, Wen-Chuan, Chang, Allen Timothy
Year of Publication 08.02.2024
Get full text
Year of Publication 08.02.2024
Patent
Wafer-level Packaging of Solid-state Biosensor, Microfluidics, and Through-Silicon Via
Huang, Jui-Cheng, Huang, Yu-Jie, Tai, Wen-Chuan, Chang, Allen Timothy
Year of Publication 07.12.2023
Get full text
Year of Publication 07.12.2023
Patent