Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect
Jian Cai, Junqiang Wang, Qian Wang, Ziyu Liu, Dejun Wang, Sun-Kyoung Seo, Tae-Je Cho
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Analysis on Distortion of Fan-Out Panel Level Packages (FOPLP)
Park, Yongjin, Kim, Bong-Soo, Ko, Tae-Ho, Kim, Sung-Hoan, Lee, Seok Won, Cho, Tae-Je
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Low temperature Cu-Cu bonding using Ag nanoparticles by PVD
Zijian Wu, Qian Wang, Lin Tan, Ziyu Liu, Sun-Kyoung Seo, Tae-Je Cho, Jian Cai
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Prevention of aluminum pad corrosion by UV/ozone cleaning
Ahn, Seung-Ho, Cho, Tae-Je, Kim, Yoon-Soo, Oh, Se-Yong
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
An improvement in reflow performance of plastic packages
Cho, Tae-je, Lee, Kyu-jin, Lee, Min-ho, Ahn, Seung-ho, Oh, Se-yong
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Model-order estimation and reduction of distributed interconnects via improved vector fitting
Sung-Hwan Min, Heeseok Lee, Eunseok Song, Yun-Seok Choi, Tae-Je Cho, Sa-Yoon Kang, Se-Yong Oh, Swaminathan, M.
Published in IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 (2005)
Published in IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 (2005)
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Conference Proceeding
A computer aided diffraction analysis in a Cu-base precipitation hardened alloy
Cho, Tae-Je, Kim, Young-Gil, Endicott, D.W.
Published in Scripta metallurgica et materialia (01.02.1994)
Published in Scripta metallurgica et materialia (01.02.1994)
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Journal Article