Directional Etching of Barrierless NiAl Lines on 300-mm Wafers for Interconnects Applications
Kundu, Souvik, Soulie, J.-P., Marti, G., Okudur, F. U., Kundu, Shreya, Souriau, L., Lazzarino, F., Murdoch, G., Park, S., Tokei, Z.
Published in IEEE electron device letters (01.10.2024)
Published in IEEE electron device letters (01.10.2024)
Get full text
Journal Article
Evaluation of Metallization Options for Advanced Cu Interconnects Application
Jourdan, Nicolas, Carbonell, Laureen, Heylen, Nancy, Swerts, Johan, Armini, S., Caro, A. Maestre, Demuynck, S., Croes, K., Beyer, G., Tökei, Zsolt, Elshocht, S. Van, Vancoille, E.
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
Get full text
Journal Article
Integration of a Stacked Contact MOL for Monolithic CFET
Vega-Gonzalez, Victor, Radisic, D., Chan, Bt, Choudhury, S., Wang, S., Mingardi, A., Le, Q. Toan, Decoster, H., Oniki, Y., Puttarame, P., Vandersmissen, K., Soulie, J.-P., Peter, A., Batuk, A. Sepulveda. D., Martinez, G. T., Richard, O., Boemmels, J., Biesemans, S., Dentoni, E., Horiguchi, N., Park, S., Tokei, Z.
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
Get full text
Conference Proceeding
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
Vandevelde, Bart, Ivankovic, A., Debecker, B., Lofrano, M., Vanstreels, K., Guo, W., Cherman, V., Gonzalez, M., Van der Plas, G., De Wolf, I., Beyne, E., Tokei, Z.
Published in Microelectronics and reliability (01.06.2014)
Published in Microelectronics and reliability (01.06.2014)
Get full text
Journal Article
Conference Proceeding
Future Logic Scaling: Towards Atomic Channels and Deconstructed Chips
Samavedam, S. B., Ryckaert, J., Beyne, E., Ronse, K., Horiguchi, N., Tokei, Z., Radu, I., Bardon, M. G., Na, M. H., Spessot, A., Biesemans, S.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Get full text
Conference Proceeding
Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias
Maestre Caro, A., Travaly, Y., Beyer, G., Tokei, Z., Maes, G., Borghs, G., Armini, S.
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
Get full text
Journal Article
Conference Proceeding
Holisitic device exploration for 7nm node
Raghavan, P., Bardon, M. Garcia, Jang, D., Schuddinck, P., Yakimets, D., Ryckaert, J., Mercha, A., Horiguchi, N., Collaert, N., Mocuta, A., Mocuta, D., Tokei, Z., Verkest, D., Thean, A., Steegen, A.
Published in 2015 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2015)
Published in 2015 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2015)
Get full text
Conference Proceeding
Vertical device architecture for 5nm and beyond: Device & circuit implications
Thean, A. V.-Y, Yakimets, D., Huynh Bao, T., Schuddinck, P., Sakhare, S., Bardon, M. Garcia, Sibaja-Hernandez, A., Ciofi, I., Eneman, G., Veloso, A., Ryckaert, J., Raghavan, P., Mercha, A., Mocuta, A., Tokei, Z., Verkest, D., Wambacq, P., De Meyer, K., Collaert, N.
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
Get full text
Conference Proceeding
Journal Article
Diffusion of chromium in ferritic and austenitic 9-20 wt-%chromium steels
Tőkei, Z., Hennesen, K., Viefhaus, H., Grabke, H.J.
Published in Materials science and technology (01.10.2000)
Published in Materials science and technology (01.10.2000)
Get full text
Journal Article
Conference Proceeding
Materials characterization of WNxCy, WNx and WCx films for advanced barriers
Volders, H, Tokei, Z, Bender, H, Brijs, B, Caluwaerts, R, Carbonell, L, Conard, T, Drijbooms, C, Franquet, A, Garaud, S, Hoflijk, I, Moussa, A, Sinapi, F, Travaly, Y, Vanhaeren, D, Vereecke, G, Zhao, C, Li, W-M, Sprey, H
Published in Microelectronic engineering (01.11.2007)
Published in Microelectronic engineering (01.11.2007)
Get full text
Journal Article
Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill
Leaming-Sphabmixay, K., Van Olmen, J., Moon, K.J., Vanstreels, Kris, D’Haen, J., Tokei, Z., List, S., Beyer, G.
Published in Microelectronic engineering (01.11.2007)
Published in Microelectronic engineering (01.11.2007)
Get full text
Journal Article
Conference Proceeding
3D Stacked Devices and MOL Innovations for Post-Nanosheet CMOS Scaling
Horiguchi, N., Mertens, H., Chiarella, T., Demuynck, S., Vega-Gonzalez, V., Vandooren, A., Veloso, A., Bardon, M. Garcia, Sisto, G., Gupta, A., Tokei, Z., Biesemans, S., Ryckaert, J.
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Get full text
Conference Proceeding
Influence of TaN Gate Electrode Microstructure on Its Dry Etch Properties
Shamiryan, D., Paraschiv, V., Tőkei, Z., Beckx, S., Boullart, W.
Published in Electrochemical and solid-state letters (01.01.2006)
Published in Electrochemical and solid-state letters (01.01.2006)
Get full text
Journal Article
Electrical performance, reliability and microstructure of sub-45nm copper damascene lines fabricated with TEOS backfill
Leaming-Sphabmixay, K, Van Olmen, J, Moon, K J, Vanstreels, Kris, D'Haen, J, Tokei, Z, List, S, Beyer, G
Published in Microelectronic engineering (01.11.2007)
Published in Microelectronic engineering (01.11.2007)
Get full text
Journal Article
Selective ALD Mo Deposition in 10nm Contacts
van der Veen, Marleen H., Maes, J. W., Pedreira, O. Varela, Zhu, C., Tierno, D., Datta, S., Jourdan, N., Decoster, S., Wu, C., Mousa, M., Byun, Y., Struyf, H., Park, S., Tokei, Z.
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Get full text
Conference Proceeding
Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track Standard Cell Architecture as Scaling Booster
Marien, P., Gonzalez, V. V., Choudhury, S., Radisic, D., Decoster, S., Kundu, S., Hermans, Y., Kenens, B., De Coster, H., Sanchez, E. A., Peter, A., Marquez, A. S., Jourdan, N., Batuk, D., Ryckaert, J., Murdoch, G., Park, S., Tokei, Z.
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Get full text
Conference Proceeding
Improving uniformity of 3-level High Aspect Ratio Supervias
Montero, D., Marien, P., Hermans, Y., Vega-Gonzalez, V., Feurprier, Y., Oikawa, N., Buccheri, N., Wu, C., Martinez, G.T., Batuk, D., Puliyalil, H., Decoster, S., Kumar, K., Lazzarino, F., Murdoch, G., Park, S., Tokei, Z.
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Get full text
Conference Proceeding
On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance
Travaly, Y., Mandeep, B., Carbonell, L., Tokei, Z., Van Olmen, J., Iacopi, F., Van Hove, M., Stucchi, M., Maex, K.
Published in IEEE transactions on semiconductor manufacturing (01.08.2007)
Published in IEEE transactions on semiconductor manufacturing (01.08.2007)
Get full text
Journal Article
Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
Croes, K, Wilson, C J, Lofrano, M, Vereecke, B, Beyer, G P, Tökei, Z
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Get full text
Conference Proceeding