Cobalt and Ruthenium drift in ultra-thin oxides
Tierno, D., Varela Pedreira, O., Wu, C., Jourdan, N., Kljucar, L., Tőkei, Zs, Croes, K.
Published in Microelectronics and reliability (01.09.2019)
Published in Microelectronics and reliability (01.09.2019)
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Journal Article
Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects
Pedreira, O. Varela, Croes, K., Lesniewska, A., Wu, C., van der Veen, M. H., de Messemaeker, J., Vandersmissen, K., Jourdan, N., Wen, L. G., Adelmann, C., Briggs, B., Gonzalez, V. Vega, Bömmels, J., Tokei, Zs
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding
Current Understanding of BEOL TDDB Lifetime Models
Croes, K., Wu, C., Kocaay, D., Li, Y., Roussel, Ph, Bömmels, J., Tőkei, Zs
Published in ECS journal of solid state science and technology (01.01.2015)
Published in ECS journal of solid state science and technology (01.01.2015)
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Journal Article
Ultra-Low Copper Baths for Sub-35 nm Copper Interconnects
Atanasova, T. A., Carbonell, L., Caluwaerts, R., Tőkei, Zs, Strubbe, K., Vereecken, P. M.
Published in Journal of the Electrochemical Society (01.01.2013)
Published in Journal of the Electrochemical Society (01.01.2013)
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Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications
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Conference Proceeding
Electron spin resonance study of defects in low- κ oxide insulators ( κ = 2.5–2.0)
Afanas’ev, V.V., Keunen, K., Stesmans, A., Jivanescu, M., Tőkei, Zs, Baklanov, M.R., Beyer, G.P.
Published in Microelectronic engineering (01.07.2011)
Published in Microelectronic engineering (01.07.2011)
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Challenges in the implementation of low-k dielectrics in the back-end of line
Hoofman, R.J.O.M., Verheijden, G.J.A.M., Michelon, J., Iacopi, F., Travaly, Y., Baklanov, M.R., Tökei, Zs, Beyer, G.P.
Published in Microelectronic engineering (01.06.2005)
Published in Microelectronic engineering (01.06.2005)
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Conference Proceeding
Low field TDDB of BEOL interconnects using >40 months of data
Croes, K., Roussel, Ph, Barbarin, Y., Wu, C., Li, Y., Bommels, J., Tokei, Zs
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
Kumaresan, V., Wilson, C.J., Verdonck, P., Van Besien, E., Lazzarino, F., Truffert, V., Bömmels, J., Tokei, Zs, Wong, T.K.S.
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Tang, B.J., Croes, K., Barbarin, Y., Wang, Y.Q., Degraeve, R., Li, Y., Toledano-Luque, M., Kauerauf, T., Bömmels, J., Tőkei, Zs, De Wolf, I.
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle
Croes, K., Cannatá, G., Zhao, L., Tőkei, Zs
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Characterisation of JSR’s spin-on hardmask FF-02
Das, A., Le, Q.T., Furukawa, Y., Nguyen, V.H., Terzieva, V., de Theije, F., Whelan, C.M., Maenhoudt, M., Struyf, H., Tókei, Zs, Iacopi, F., Stucchi, M., Carbonell, L., Vos, I., Bender, H., Patz, M., Beyer, G., Van Hove, M., Maex, K.
Published in Microelectronic engineering (01.11.2003)
Published in Microelectronic engineering (01.11.2003)
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Barrier and seed repair performance of thin RuTa films for Cu interconnects
Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Towards the understanding of intrinsic degradation and breakdown mechanisms of a SiOCH low-k dielectric
Wu, C., Li, Y., Barbarin, Y., Ciofi, I., Tang, B., Kauerauf, T., Croes, K., Bommels, J., De Wolf, I., Tokei, Zs
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
Evaluating k-values for low -k materials after damascene integration: Method and results
Vereecke, B., Pantouvaki, M., Ciofi, I., Beyer, G.P., Tökei, Zs
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
Tőkei, Zs, Patz, M., Schmidt, M., Iacopi, F., Demuynck, S., Maex, K.
Published in Microelectronic engineering (01.10.2004)
Published in Microelectronic engineering (01.10.2004)
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Interconnect metals beyond copper: reliability challenges and opportunities
Croes, K., Adelmann, Ch, Wilson, C.J., Zahedmanesh, H., Pedreira, O. Varela, Wu, C., Lesniewska, A., Oprins, H., Beyne, S., Ciofi, I., Kocaay, D., Stucchi, M., Tokei, Zs
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
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