by Lau, John H., Ming Li, Dewen Tian, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Yiu Ming Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Taylor, Thomas, Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Jiang Ran, Cao Xi, Koh Sau Wee, Qingxiang Yong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)

by Lau, John H., Ming Li, Li Qingqian, Margie, Chen, Tony, Xu, Iris, Qing Xiang Yong, Zhong Cheng, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Lo, Penny, Wu Kai, Ji Hao, Koh Sau Wee, Jiang Ran, Cao Xi, Beica, Rozalia, Sze Pei Lim, Lee, N. C., Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Mian Tao, Lo, Jeffery, Lee, Ricky S. W.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2018)

by Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, Eric, Kai, Wu, Cheung, Yiu-Ming, Ng, Eric, Xi, Cao, Ran, Jiang, Yang, Henry, Chen, Y. H., Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2018)

by Lau, John H., Li, Ming, Yang, Lei, Li, Margie, Xu, Iris, Chen, Tony, Chen, Sandy, Yong, Qing Xiang, Madhukumar, Janardhanan Pillai, Kai, Wu, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Bao, Winsons, Lim, Sze Pei, Beica, Rozalia, Ko, Cheng-Ta, Xi, Cao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2018)

by Cheng-Ta Ko, Yang, Henry, Lau, John H., Ming Li, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Qing Xiang Yong, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Wu Kai, Ji Hao, Beica, Rozalia, Lin, Marc, Yu-Hua Chen, Zhong Cheng, Koh Sau Wee, Jiang Ran, Cao Xi, Sze Pei Lim, Lee, N. C., Mian Tao, Lo, Jeffery, Lee, Ricky S. W.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2018)

by Zhang, HongWen, Lim, Sze Pei
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)

by Lim, Sze Pei, Tsuriya, Masahiro, Gokhale, Shripad, Kastberg, Russell
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)

by Lim, Sze-Pei
Published in 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.02.2018)

by Murayama, Kei, Oon Lee, Kor, Ono, Toshiaki, Oi, Kiyoshi, Pei Lim, Sze, Yeo, Yvonne, Sweatman, Keith, Martell, Steven R., Shimamoto, Haruo, Tsuriya, Masahiro
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Sze-Pei Lim, Thum, Kenneth, Mackie, Andy
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)

by Chiong, Kenny, HongWen Zhang, Sze Pei Lim
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)

by Lau, John, Ming Li, Tian, Dewen, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Ken Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Cheng-Ta Ko, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Koh Sau Wee, Ran, Jiang, Xi, Cao
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Lau, John, Li, Ming, Xu, Iris, Chen, Tony, Tan, Kim Hwee, Li, Zhang, Fan, Nelson, Kuah, Eric, So, Raymond, Lo, Penny, Cheung, Y. M., Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)

by Sheng-Hung Chou, Yan Liu, Durham, Maria, Sze Pei Lim, Te-Hua Fang, Yu-Jen Hsiao
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)

by Lau, John, Li, Ming, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Chen, Tony, Xu, Iris, Li, Margie, Cheung, Y. M., Kai, Wu, Hao, Ji, Beica, Rozalia, Taylor, Tom, Ko, CT, Yang, Henry, Chen, Y. H., Lim, Sze Pei, Lee, N. C., Ran, Jiang, Wee, Koh Sau, Yong, Qingxiang, Xi, Cao, Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in Journal of microelectronics and electronic packaging (01.10.2017)

by Ko, Cheng-Ta, Yang, Henry, Lau, John, Li, Ming, Li, Margie, Lin, Curry, Lin, J. W., Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Chen, Yu-Hua, Chen, Tony, Xu, Iris, Lo, Penny, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Lin, Chia-Hung, Beica, Rozalia, Lin, Marc, Xi, Cao, Lim, Sze Pei, Lee, Ning Cheng, Tao, Mian, Lo, Jeffery, Lee, Ricky
Published in Journal of microelectronics and electronic packaging (01.10.2018)

by Thum, Kenneth, Lim, Sze Pei
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)

by Lim, Sze Pei, Arvin, Charles, Sweatman, Keith, Tsuriya, Masahiro
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)

by Zhang, Hongwen, Lim, Sze Pei, Lytwynec, Samuel, Richmond, Tyler, Harter, Tybarius, Prado, Diego
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19.10.2022)

by Zhang, Hongwen, Lim, Sze Pei, Lytwynec, Samuel, Richmond, Tyler, Harter, Tybarius, Prado, Diego
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19.10.2022)