Optical proximity communication using reflective mirrors
Zheng, Xuezhe, Cunningham, John E, Shubin, Ivan, Simons, John, Asghari, Mehdi, Feng, Dazeng, Lei, Hongbin, Zheng, Dawei, Liang, Hong, Kung, Cheng-chih, Luff, Jonathan, Sze, Theresa, Cohen, Danny, Krishnamoorthy, Ashok V
Published in Optics express (15.09.2008)
Published in Optics express (15.09.2008)
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Journal Article
Optical interconnects: out of the box forever?
Dawei Huang, Sze, T., Landin, A., Lytel, R., Davidson, H.L.
Published in IEEE journal of selected topics in quantum electronics (01.03.2003)
Published in IEEE journal of selected topics in quantum electronics (01.03.2003)
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Journal Article
Interconnect Technologies and Advanced Packaging for High Performance Computing
Shi, Jing, Sze, Theresa, Song, Deqiang, Huang, Dawei, Cunningham, John E.
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package : Advances in wafer level packaging
SZE, Theresa, POPOVIC, Darko, JING SHI, LAI, Yi-Shao, MITCHELL, James G, GUENIN, Bruce, TSAI, Tsung-Yueh, KAO, Chin-Li, GIERE, Matthew
Published in Microelectronics and reliability (2010)
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Published in Microelectronics and reliability (2010)
Journal Article
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package
Sze, Theresa, Popovic, Darko, Shi, Jing, Lai, Yi-Shao, Mitchell, James G., Guenin, Bruce, Tsai, Tsung-Yueh, Kao, Chin-Li, Giere, Matthew
Published in Microelectronics and reliability (01.04.2010)
Published in Microelectronics and reliability (01.04.2010)
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Journal Article
CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
SZE, Theresa, RAJ, Kannan, HUANG, Dawei, MCELFRESH, David K, ANESHANSLEY, Nicholas E
Year of Publication 08.04.2020
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Year of Publication 08.04.2020
Patent
Chip assembly configuration with densely packed optical interconnects
SZE THERESA, MCELFRESH DAVID K, ANESHANSLEY NICHOLAS E, HUANG DAWEI, RAJ KANNAN
Year of Publication 04.03.2015
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Year of Publication 04.03.2015
Patent
CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Year of Publication 07.01.2015
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Year of Publication 07.01.2015
Patent
CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Year of Publication 27.12.2013
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Year of Publication 27.12.2013
Patent
CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Year of Publication 06.09.2013
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Year of Publication 06.09.2013
Patent
CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
SZE THERESA, MCELFRESH DAVID K, ANESHANSLEY NICHOLAS E, HUANG DAWEI, RAJ KANNAN
Year of Publication 05.09.2013
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Year of Publication 05.09.2013
Patent
Direct chip powering and enhancement of proximity communication through Anisotropic Conductive adhesive chip-to-chip bonding
Jing Shi, Popovic, Darko, Nettleton, Nyles, Sze, Theresa, Douglas, David, Thacker, Hiren, Cunningham, John, Furuta, Kazutaka, Kojima, Ryoji, Hirose, Koichi, Hwang, Kuopin
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Chip assembly configuration with densely packed optical interconnects
HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Year of Publication 11.09.2017
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Year of Publication 11.09.2017
Patent
Chip package with plank stack of semiconductor dies
SHUBIN IVAN, POPOVIC DARKO R, SHI JING, SZE THERESA Y, GIERE MATTHEW D, HARADA JOHN A, GUENIN BRUCE M, DOUGLAS DAVID C
Year of Publication 05.03.2013
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Year of Publication 05.03.2013
Patent
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
SHUBIN IVAN, POPOVIC DARKO R, SHI JING, SZE THERESA Y, GIERE MATTHEW D, HARADA JOHN A, GUENIN BRUCE M, DOUGLAS DAVID C
Year of Publication 23.08.2012
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Year of Publication 23.08.2012
Patent
Optical interconnect
SZE THERESA, NETTLETON NYLES, DAVIDSON HOWARD, HUANG DAWEI, LYTEL RICK
Year of Publication 16.09.2003
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Year of Publication 16.09.2003
Patent
Optical interconnect
Lytel, Rick, Davidson, Howard, Sze, Theresa, Nettleton, Nyles, Huang, Dawei
Year of Publication 16.09.2003
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Year of Publication 16.09.2003
Patent
OPTICAL INTERCONNECT
LYTEL, RICK, DAVIDSON, HOWARD, NETTLETON, NYLES, HUANG, DAWEI, SZE, THERESA
Year of Publication 28.11.2002
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Year of Publication 28.11.2002
Patent
Chip assembly configuration with densely packed optical interconnects
HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Year of Publication 01.01.2014
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Year of Publication 01.01.2014
Patent