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Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration
Do Nascimento, Vinicius C., Hwang, Seunghyun, Joseph Smith, Michael, Kulkarni, Tejas, Qiu, Qiang, Koh, Cheng-Kok, Subbarayan, Ganesh, Jiao, Dan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2025)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2025)
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RF Devices Integrated by Fan-Out and System-In-Package Technology
Kung, Cheng-Yuan, Lin, Hung-Yi, Kuo, Chin-Cheng, Wu, Cheng-Syuan, Chen, Yu-Ting, Hsieh, Meng-Wei, Hsieh, Yu-Chang, Lee, Pao-Nan
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (26.10.2022)
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (26.10.2022)
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Evolution of Photonics-Electronics Convergence Technology - Can We Make It, How and when?
Shirao, Mizuki, Lo, Patrick, Jiao, Yuqing
Published in Optoelectronics and Communications Conference (29.06.2025)
Published in Optoelectronics and Communications Conference (29.06.2025)
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CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRUCTURE
FULLER, JR. JAMES W, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I, KNIGHT JEFFREY
Year of Publication 04.10.2012
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Year of Publication 04.10.2012
Patent
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Chiplets and Next-gen Packaging Technologies in University Education
Jajaie, Anda, Puscasu, Alexandru, Ailenei, Ioana, Ciobanu, Catalin Bogdan, Svasta, Paul
Published in IEEE ... International Symposium for Design and Technology of Electronics Packages (SIITME) (18.10.2023)
Published in IEEE ... International Symposium for Design and Technology of Electronics Packages (SIITME) (18.10.2023)
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Overcoming Assembly Process Challenges in Glass Interposer: Development of Jigs and Fixtures
Ubed, Mohammed, Ramana, Pamidigantam, Veerandi, Anusha, Kumar Yeluripati, Rohin, G, VenuGopal
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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3D Heterogeneous Integration with Multiple Stacking Fan-Out Package
Feng-Cheng Hsu, Lin, Jackson, Shuo-Mao Chen, Po-Yao Lin, Fang, Jerry, Jin-Hua Wang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Multilayer thick-film photoimageable technology for 60 GHz system-in-package
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Conference Proceeding
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SEALING RESIN, RESIN-SEALED SEMICONDUCTOR AND SYSTEM-IN-PACKAGE
Year of Publication 07.04.2005
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Patent
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An efficient approach to sip design integration
Meng-Syue Chan, Chun-Yao Wang, Yung-Chih Chen
Published in 2009 10th International Symposium on Quality Electronic Design (01.03.2009)
Published in 2009 10th International Symposium on Quality Electronic Design (01.03.2009)
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Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate
Bavisi, A., Dalmia, S., Swaminathan, M., White, G., Sundaram, V.
Published in IEEE transactions on advanced packaging (01.08.2006)
Published in IEEE transactions on advanced packaging (01.08.2006)
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Journal Article