Study on creep fatigue behaviour of soft solders die attach for power package applications
Dandong Ge, Che, F. X., Yik Siong Tay, Swee Lee Gan, Yazid, M.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Pd coated Cu wire bond on XoAA material in LQFP package
Wang Mei Yong, Teo, J., Gan Swee Lee, Tan Kian Heong, Swee, A.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Creep properties of soft solder die attach with Ni balls in power package applications
Che, F. X., Dandong Ge, Yik Siong Tay, Yazid, M., Swee Lee Gan
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Semi-quantitative analysis of trace elements by Secondary Ion Mass Spectrometry
Dandong Ge, Harald, P, Gan Swee Lee, Koh, L K I
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
New Perspective on Understanding Contact between Metal and Oxide Through Atomistic Modeling: A Case Study on Tin Oxide in Contact with Common Metals
Tian, Yujia, Kripalani, Devesh, Xue, Ming, Gan, Swee Lee, Zhou, Kun
Published in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.07.2024)
Published in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.07.2024)
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Conference Proceeding
The impact of high glass transition temperature of molding compounds on power package warpage and stress performance
Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Test pin configuration for test device for testing devices under test
Sugianto, Yusman, Swee Lee, Gan, Chyeo Yong, Tay, Tan, Wee Kuan, Hudda, Murad, Hiew, Fu San, Yussuff, Arieff Ridzwan, Tan, Siao Kiat, Xiaojun, Wang, Dandong, Ge, Chow York, Lee
Year of Publication 05.02.2019
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Year of Publication 05.02.2019
Patent
Test Pin Configuration for Test Device for Testing Devices Under Test
TAN Wee Kuan, HIEW Fu San, TAN Siao Kiat, YUSSUFF Arieff Ridzwan, CHYEO YONG Tay, SUGIANTO Yusman, CHOW YORK Lee, SWEE LEE Gan, DANDONG Ge, HUDDA Murad, XIAOJUN Wang
Year of Publication 22.06.2017
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Year of Publication 22.06.2017
Patent
Prüfstiftkonfiguration für eine Prüfvorrichtung zum Prüfen von Prüflingen
Sugianto, Yusman, Gan, Swee Lee, Hudda, Murad, Tan, Wee Kuan, Hiew, Fu San, Yussuff, Arieff Ridzwan, Lee, Chow York, Tan, Siao Kiat, Ge, Dandong, Wang, Xiaojun, Tay, Chyeo Yong
Year of Publication 22.06.2017
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Year of Publication 22.06.2017
Patent