Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs
Liu, Zao, Swarup, Sahana, Tan, Sheldon X.-D, Chen, Hai-Bao, Wang, Hai
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.10.2014)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.10.2014)
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Journal Article
A power-driven thermal sensor placement algorithm for dynamic thermal management
Wang, Hai, Tan, Sheldon X.-D., Swarup, Sahana, Liu, Xue-Xin
Published in 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2013)
Published in 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2013)
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Conference Proceeding
Battery state of charge estimation using adaptive subspace identification method
Swarup, S., Tan, S. X.-D, Zao Liu, Hai Wang, Zhigang Hao, Guoyong Shi
Published in 2011 9th IEEE International Conference on ASIC (01.10.2011)
Published in 2011 9th IEEE International Conference on ASIC (01.10.2011)
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Conference Proceeding
Compact lateral thermal resistance modeling and characterization for TSV and TSV array
Zao Liu, Swarup, Sahana, Tan, Sheldon X.-D
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
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Conference Proceeding
Thermal characterization of TSV based 3D stacked ICs
Swarup, S., Tan, S. X-D, Zao Liu
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding
A power-driven thermal sensor placement algorithm for dynamic thermal management
Wang, Hai, Tan, Sheldon X.-D., Swarup, Sahana, Liu, Xue-Xin
Published in Proceedings of the Conference on Design, Automation and Test in Europe (18.03.2013)
Published in Proceedings of the Conference on Design, Automation and Test in Europe (18.03.2013)
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Conference Proceeding
Compact nonlinear thermal modeling of packaged integrated systems
Zao Liu, Tan, Sheldon X.-D, Hai Wang, Swarup, Sahana, Gupta, Ashish
Published in 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2013)
Published in 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2013)
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Conference Proceeding