Thermal management in integrated circuit packages
Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 28.11.2023
Get full text
Year of Publication 28.11.2023
Patent
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
Aleksov, Aleksandar, Le, Van H, Eid, Feras, Liff, Shawna M, Elsherbini, Adel A, Osborne, Randy B, Swan, Johanna M
Year of Publication 10.10.2024
Get full text
Year of Publication 10.10.2024
Patent
Multi-chip package and method of providing die-to-die interconnects in same
Aleksov, Aleksandar, Chiu, Chia-Pin, Sharan, Sujit, Au, Hinmeng, Braunisch, Henning, Lotz, Stefanie M, Swan, Johanna M
Year of Publication 08.10.2024
Get full text
Year of Publication 08.10.2024
Patent
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 26.10.2023
Get full text
Year of Publication 26.10.2023
Patent
Thermal management in integrated circuit packages
Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 10.10.2023
Get full text
Year of Publication 10.10.2023
Patent
Die backend diodes for electrostatic discharge (ESD) protection
Aleksov, Aleksandar, Eid, Feras, Elsherbini, Adel A, Strong, Veronica Aleman, Swan, Johanna M
Year of Publication 10.10.2023
Get full text
Year of Publication 10.10.2023
Patent
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A CHASSIS, WHERE WAVEGUIDES COUPLE THE MICROELECTRONIC PACKAGES TO EACH OTHER AND USABLE IN A COMPUTING DEVICE
Aleksov, Aleksandar, Dogiamis, Georgios, Elsherbini, Adel A, Dischler, Richard, Braunisch, Henning, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 05.10.2023
Get full text
Year of Publication 05.10.2023
Patent
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 04.10.2023
Get full text
Year of Publication 04.10.2023
Patent
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 04.10.2023
Get full text
Year of Publication 04.10.2023
Patent
Direct bonding in microelectronic assemblies
Aleksov, Aleksandar, Le, Van H, Eid, Feras, Liff, Shawna M, Elsherbini, Adel A, Osborne, Randy B, Swan, Johanna M
Year of Publication 06.08.2024
Get full text
Year of Publication 06.08.2024
Patent
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 13.09.2023
Get full text
Year of Publication 13.09.2023
Patent
Microelectronic package electrostatic discharge (ESD) protection
Aleksov, Aleksandar, Eid, Feras, Elsherbini, Adel A, Strong, Veronica Aleman, Swan, Johanna M
Year of Publication 05.09.2023
Get full text
Year of Publication 05.09.2023
Patent
Microelectronic assemblies with communication networks
Liff, Shawna M, Elsherbini, Adel A, Chandrasekhar, Arun, Elshazly, Amr, Swan, Johanna M
Year of Publication 05.09.2023
Get full text
Year of Publication 05.09.2023
Patent
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 30.08.2023
Get full text
Year of Publication 30.08.2023
Patent
Waveguide fan-out
Aleksov, Aleksandar, Dogiamis, Georgios, Elsherbini, Adel A, Braunisch, Henning, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 15.08.2023
Get full text
Year of Publication 15.08.2023
Patent
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device
Aleksov, Aleksandar, Dogiamis, Georgios, Elsherbini, Adel A, Dischler, Richard, Braunisch, Henning, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 01.08.2023
Get full text
Year of Publication 01.08.2023
Patent