Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer
Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Self-assembled layer as an effective way to block copper diffusion into epoxy
Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki
Published in Materials letters (15.07.2024)
Published in Materials letters (15.07.2024)
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Journal Article