Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr, Mukhopadhyay, Biswajit, Ehrmann, Oswin, Lang, Klaus-Dieter, Woratz, Michael, Herrmann, Peter, Pohl, Olaf, Noack, Volker, Suyao Zhou, Quoc Cuong Dao, Thanh Hai Hoang, Ha-Duong Ngo
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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