Reliability studies on micro-bumps for 3-D TSV integration
Ho-Young Son, Sung-Kwon Noh, Hyun-Hee Jung, Woong-Sun Lee, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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