Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs
Chaudhuri, Arjun, Banerjee, Sanmitra, Park, Heechun, Ku, Bon Woong, Chakrabarty, Krishnendu, Lim, Sung-Kyu
Published in 2019 IEEE European Test Symposium (ETS) (01.05.2019)
Published in 2019 IEEE European Test Symposium (ETS) (01.05.2019)
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Conference Proceeding
Automatic cell placement for quantum-dot cellular automata
Ravichandran, Ramprasad, Lim, Sung Kyu, Niemier, Mike
Published in Integration (Amsterdam) (01.01.2005)
Published in Integration (Amsterdam) (01.01.2005)
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Journal Article
Conference Proceeding
Ultra-high density 3D SRAM cell designs for monolithic 3D integration
Chang Liu, Sung Kyu Lim
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
Heterogeneous 3D ICs: Current Status and Future Directions for Physical Design Technologies
Murali, Gauthaman, Lim, Sung Kyu
Published in 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.02.2021)
Published in 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.02.2021)
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Conference Proceeding
Transferable Graph Neural Network-based Delay-Fault Localization for Monolithic 3D ICs
Hung, Shao-Chun, Banerjee, Sanmitra, Chaudhuri, Arjun, Kim, Jinwoo, Lim, Sung Kyu, Chakrabarty, Krishnendu
Published in IEEE transactions on computer-aided design of integrated circuits and systems (10.05.2023)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (10.05.2023)
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Journal Article
A 14nm FinFET transistor-level 3D partitioning design to enable high-performance and low-cost monolithic 3D IC
Jiajun Shi, Nayak, Deepak, Banna, Srinivasa, Fox, Robert, Samavedam, Srikanth, Samal, Sandeep, Sung Kyu Lim
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01.12.2016)
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01.12.2016)
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Conference Proceeding
Heterogeneous Monolithic 3D ICs: EDA Solutions, and Power, Performance, Cost Tradeoffs
Pentapati, Sai Surya Kiran, Lim, Sung Kyu
Published in 2021 58th ACM/IEEE Design Automation Conference (DAC) (05.12.2021)
Published in 2021 58th ACM/IEEE Design Automation Conference (DAC) (05.12.2021)
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Conference Proceeding
High-density integration of functional modules using monolithic 3D-IC technology
Panth, S., Samadi, K., Yang Du, Sung Kyu Lim
Published in 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2013)
Published in 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2013)
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Conference Proceeding
Transferable Graph Neural Network-Based Delay-Fault Localization for Monolithic 3-D ICs
Hung, Shao-Chun, Banerjee, Sanmitra, Chaudhuri, Arjun, Kim, Jinwoo, Lim, Sung Kyu, Chakrabarty, Krishnendu
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.11.2023)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.11.2023)
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Journal Article
Die-to-package coupling extraction for fan-out wafer-level-packaging
Yarui Peng, Petranovic, Dusan, Sung Kyu Lim
Published in 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2017)
Published in 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2017)
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Conference Proceeding